Cadence 推出全面的终端侧 Tensilica AI 平台， 加速智能系统级芯片开发
新的 Tensilica AI 引擎提高了性能，AI 加速器为消费、移动、汽车和工业 AI 系统级芯片设计提供了一站式解决方案
13 Sep 2021
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Cadence 推出全面的终端侧 Tensilica AI 平台， 加速智能系统级芯片开发Released Date: 13 Sep 2021 |
Cadence和三星加速开发3纳米混合信号设计Released Date: 08 Sep 2021 |
Cadence’s Anirudh Devgan and John Wall to Present at the D.A. Davidson Software & Internet ConferenceReleased Date: 02 Sep 2021 |
比科奇Picocom 使用 Cadence Palladium Emulation 硬件仿真平台 加速 5G 通信系统级芯片开发Released Date: 18 Aug 2021 |
Tower Semiconductor与Cadence 宣布，共同推出面向先进 5G 通信和汽车芯片开发全新参考流程Released Date: 16 Aug 2021 |
Cadence’s Anirudh Devgan and John Wall to Present at the KeyBanc Technology Leadership ForumReleased Date: 02 Aug 2021 |
Cadence Tensilica Xtensa 处理器满足最严格的汽车功能安全要求，完全达到 ISO 26262 ASIL-D 等级Released Date: 28 Jul 2021 |
Cadence Reports Second Quarter 2021 Financial ResultsReleased Date: 26 Jul 2021 |
Cadence宣布Anirudh Devgan于12月担任公司CEO，陈立武将任职执行董事长Released Date: 26 Jul 2021 |
Cadence 推出革命性新产品Cerebrus——完全基于机器学习 ，提供一流生产力和结果质量，拓展数字设计领导地位Released Date: 22 Jul 2021 |
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