Photonics Summit and Workshop 2017

Speaker

Topic

Andrew Wheeler
Hewlett Packard Enterprise, HPE Fellow & Deputy Director of Hewlett Packard Labs

Photonics: The Fabric of Our (Future) Lives
In this session, HPE Fellow Andrew Wheeler and one of the key minds behind Memory-Driven Computing, will share how HPE’s ongoing stream of innovations in VCSEL and silicon photonics will enable the industry to meet the bandwidth, power, cost and packaging challenges as we move into the petascale era and look towards the exascale.
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Senior PhD student, MIT

Programmable Nanophotonics for Quantum Information Processing and Artificial Intelligence

Silicon photonics offers a promising platform for new computational architectures, such as deep learning and quantum computation. We discuss optical implementations of artificial neural networks, quantum simulation, and other quantum information protocols using programmable nanophotonic processors.
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Dr. Michal Rakowski
IC design specialist,3D and optical I/O technologies, imec

In this talk, we will give an overview of recent progress in the development of a SiPh platform enabling 56G NRZ lane rates. We will discuss key passive SiPh device building blocks and review various options for realizing low-voltage 56G silicon integrated optical modulators and Ge waveguide photodetectors. Finally, we will introduce our emerging 300mm SiPh interposer platform with TSVs.
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Paul Fortier
Advisory Engineer, Optoelectronic and Semiconductor Packaging Development, IBM Assembly and Test Services

Automated High-Throughput Assembly Processes for Photonic Packaging
IBM has developed low-cost and scalable packaging approaches for optical fiber interfacing to the photonics die, using both a compliant polymer interface and a parallelized fiber array, as well as a photonic flip-chip approach for the integration of secondary photonic chips, such as lasers. This technology has reached the yield and reliability testing stage and is to be offered as a service at the IBM assembly and test manufacturing center in Bromont, Canada.
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Dan Neugroschl
President, Chiral Photonics, Inc.

Optical I/O Considerations for PIC Coupling and Packaging
Overview of optical input/output (I/O) considerations for photonic integrated circuits (PICs) with regard to chip design, probing, and packaging.
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Pavel Zivny
Tektronix High Speed Serial Data Measurements Expert

On Figure of Merit in PAM4 Optical Transmitter Evaluation, Particularly TDECQ
A brief presentation assessing current state of the art in evaluation of optical transmitters for PAM2 and PAM4 links. Focus on transition from TDP and Mask Test to TDEC and TDECQ, some comments on alternatives. Practical outcomes from 100G and 400G systems with 28GBd and 56GBd signaling in optical Ethernet, 112 GBd outlook.
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