Date EVENT NAME TECHNOLOGY Location Event Type
10 Feb 2022

CadenceTECHTALK: Accelerate Innovation with the Omnis Automotive Wizard for CFD Simulations

Join us as we demonstrate how the Omnis Automotive Wizard accurately predicts the real-life behavior of a vehicle offering a streamlined end-to-end workflow, from meshing through simulation to results analysis and optimization in one single environment.

CFD, Automotive Online
16 Feb 2022

CadenceTECHTALK: Toyota Drastically Reduces Simulation Time With Automatic CFD Pre-Processing Workflow

Creating a detailed CFD model for automotive applications normally requires a huge amount of manual work. Toyota eliminates this work thanks to an innovative CFD pre-processing workflow, and in this webinar they will show you how. Join us for this webinar and watch how this allows them to quickly generate models, ready-to-run, with almost no human intervention, drastically reducing simulation turn-around time.

CFD Online Cadence Event
17 Feb 2022

CadenceTECHTALK: Cadence Integrated Platform Solution for 3D-IC Design (Taiwan)

This webinar will discuss technology that proactively looks ahead through integrated early analysis, and addresses all aspects of 3D-IC design comprehensively, including system planning, packaging, implementation, analysis, and system-level signoff. It will discuss requirements and implementation flows for InFO, CoWoS, and SoIC, along with unique Pseudo-3D exploration capabilities that enable PPA push and the feasibility of 2D to 3D design conversion.

Digital Design and Signoff Online Cadence Event
17 Feb 2022

CadenceTECHTALK: Mixed Signal SoC Verification Simplified with Xcelium Simulator

Join this CadenceTECHTALK™ to learn how Cadence is providing effective verification and debug methodologies using RNM of analog blocks for mixed-signal SoC verification.

Analog Mixed-Signal Design, Verification IP, System Design and Verification Online Cadence Event
18 Feb 2022 - 20 Feb 2022

TreeHacks 2022

Join Cadence at treehacks, Stanford University’s largest annual hackathon for college students. This hackathon will bring together 1500 of the world’s brightest students for 36 hours to dream up a better world – and build it.

Virtual / Stanford, CA, USA Industry Conference
22 Feb 2022

CadenceTECHTALK: Helium Virtual and Hybrid Studio (Taiwan)

In this CadenceTECHTALK™, we will show you the configuration and basic features of Cadence® Helium ™ Virtual and Hybrid Studio, a platform that accelerates the creation of virtual and hybrid prototypes of complex systems.

System Design and Verification Online Cadence Event
23 Feb 2022 - 24 Feb 2022

CadenceTECHTALK: Efficient Multi-Chiplet Design with Cadence Integrity 3D-IC Unified Platform

Join the first session of a new CadenceTECHTALK series "Adopting a Faster, More Efficient Path to Multi-Chiplet Design" and learn about different packaging styles, innovative multi-technology database, integrated system planner, and an embedded analysis flow manager inside the Integrity 3D-IC platform, which provide a comprehensive, yet modular multi-chiplet design solution to help shorten the design cycle for all aspects of 3D-IC design and signoff.

3D-IC, IC Packaging and SiP Design, PCB Design, Digital Implementation Online Cadence Event
09 Mar 2022

CadenceTECHTALK: System Planning and Implementation for Different 3D-IC Design Styles

Join this next webinar in "Adopting a Faster, More Efficient Path to Multi-Chiplet Design" webinar series to learn about the different approaches to 3D partitioning, implementation, and unique capabilities available with the Cadence® Integrity™ 3D-IC platform for bump planning, interposer routing, and top-down 3D partitioning and implementation.

3D-IC, IC Packaging and SiP Design, PCB Design, Digital Implementation Online Cadence Event
23 Mar 2022

CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis

Next session in "Adopting a Faster, More Efficient Path to Multi-Chiplet Design" webinar series will help you to get a chip-centric perspective on performing PI and thermal integrity analysis in 3D-ICs from early planning to signoff.

3D-IC, IC Packaging and SiP Design, PCB Design, Digital Implementation Online Cadence Event
06 Apr 2022

CadenceTECHTALK: Overcoming System-Level 3D-IC Electrical and Thermal Challenges

The last webinar series, "Adopting a Faster, More Efficient Path to Multi-Chiplet Design," addressed the growing system analysis challenges 3D-IC designers face related to signal, power, and thermal integrity and demonstrated how addressing these concerns through simulation during system planning and signoff accelerates the 3D-IC design cycle.

3D-IC, IC Packaging and SiP Design, PCB Design, Digital Implementation Online Cadence Event