CDNLive China 2019 Proceedings

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尖端设计工具

数字设计与Signoff
定制 IC/模拟/ RF 设计
系统设计与验证
IP
IC 封装设计与分析

创新系统设计

系统分析
嵌入式原型验证
PCB 设计与分析

万物智能

AI / 机器学习
AI IP 产品

CADENCE云服务

数字设计与Signoff

Cadence^® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

逻辑等效性检查
Innovus Implementation and Floorplanning
形式验证与功能 ECO
低功耗验证
RTL 综合
功耗分析
Constraints and CDC Signoff
硅签收
Library Characterization
可测性设计
Flows
Achieve best PPA with the next-generation Digital Full Flow solution Learn More
Address digital implementation challenges with machine learning Watch Now

定制 IC/模拟/ RF 设计

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

电路设计
电路仿真
版图设计
版图验证
特征库提取
RF / Microwave Solutions
流程
Solve analog simulation challenges in complex designs Watch Now
See how the Virtuoso Design Platform addresses advanced custom IC and system design challenges Watch Now

系统设计与验证

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

调试纠错分析
硬件仿真加速器
形式化验证与静态验证
FPGA 原型验证
验证规划与管理
仿真
软件驱动验证
验证IP(VIP)
Flows
Prototype your embedded software development Watch Now
Learn how early firmware development enabled first silicon success at Toshiba Memory Watch Now

An open IP platform for you to customize your app-driven SoC design.

Interface IP
Denali Memory IP
Tensilica 处理器 IP
Analog IP
System / Peripherals IP
验证 IP
Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
Meeting the needs of 5G communication with Tensilica^® ConnX B20 DSP IP Download Now

IC 封装设计与分析

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

跨平台协同设计与分析
IC 封装设计
SI/PI Analysis
SI/PI 分析点工具
Flows
Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

系统分析

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
Electromagnetic Solutions
RF / Microwave Solutions
Thermal Solutions

嵌入式原型验证

PCB 设计与分析

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.