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Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation and Prototyping
          • Formal and Static Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • Flows
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Omnis
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
          • AWR Software Download Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
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        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
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        • RF / Microwave
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        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
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        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
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        • AI / Machine Learning
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Celsius Thermal Solver

Electrical-thermal co-simulation for system analysis

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Key Benefits

  • Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy
  • Integration with Cadence IC, package, and PCB implementation platforms accelerates and simplifies design iterations
  • Transient as well as steady-state analysis enable accurate electrical-thermal co-simulation
  • Combination of FEA and CFD provides total system analysis

The Cadence® Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture that delivers up to 10X faster performance than legacy solutions without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and PCB implementation platforms. This enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.

ASK US A QUESTION
Temperature profile of IC package interconnect structures
Multi-Physics Technology

IC and electronic systems companies, particularly those incorporating 3D-IC packaging, face tremendous thermal challenges that can cause late-stage design modifications and iterations and derail project schedules. As the electronics industry moves toward smaller, faster, smarter, and more complex products with greater power density, time-consuming thermal transient analysis techniques must be deployed together with traditional steady-state analysis to address multiple power profiles and increased heat dissipation. Further complicating the process, traditional thermal simulators require simplified models of the electronics and enclosures, resulting in reduced accuracy.

The Celsius Thermal Solver utilizes innovative multi-physics technology to address these challenges. By combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids, the Celsius Thermal Solver enables complete system analysis in a single tool.

 

Combination of FEA for solid structures with CFD for airflow
Integrated Solution and Transient Capability

When using the Celsius Thermal Solver in conjunction with the Clarity™ 3D Solver, Voltus™ IC Power Integrity, and Sigrity™ technology for PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both electricity and heat for a more accurate system-level thermal simulation than legacy tools. In addition, the Celsius Thermal Solver performs both static (steady-state) and dynamic (transient) electrical-thermal co-simulations based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behavior.

 

Transient electrical-thermal co-simulation example

 

By empowering electronics design teams to analyze thermal issues early and share ownership of thermal analysis, the Celsius Thermal Solver reduces design re-spins and enables new analysis and design insights not possible with legacy solutions. In addition, the Celsius Thermal Solver accurately simulates large systems with detailed granularity for any object of interest and is the first solution capable of modeling structures as small as the IC and its power distribution together with structures as large as the chassis.

Contact Us

Rising to Meet the Thermal
Challenge Technical Brief
DOWNLOAD TECHNICAL BRIEF
Customer Paper from
InterPACK
DOWNLOAD PAPER

Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver

  • Related Products

    • Voltus IC Power Integrity Solution
    • Virtuoso System Design Platform
    • Allegro PCB Designer
    • Allegro Package Designer Plus
    • Allegro Package Designer Plus SiP Layout Option
    • Clarity 3D Solver
    • Clarity 3D Transient Solver
Videos

Announcing Celsius Thermal Solver, a New Approach to System-Level Thermal Analysis

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 1

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 2

The Need for Electro-Thermal Co-simulation

Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver

News ReleasesVIEW ALL
  • Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis 03/16/2021

  • Cadence Completes Acquisition of NUMECA 02/24/2021

  • Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics 01/20/2021

  • Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs 12/16/2020

  • Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers 12/02/2020

Blogs VIEW ALL
Customers

The Cadence Celsius Thermal Solver is tightly integrated with the Virtuoso platform, which makes electro-thermal simulations easily and directly accessible to advanced circuit, layout and package designers. The Celsius Thermal Solver offers fast turnaround times and accurate results.

Goeran Jerke, senior project manager EDA Research and Advance Development, Automotive Electronics Division, Robert Bosch GmbH

The addition of the Celsius Thermal Solver to Cadence’s system analysis portfolio allows our mutual customers to deliver next-generation electronic systems because we are now able to support thermal and electrical co-simulation in our design flows.

Vicki Mitchell, vice president of systems engineering, Central Engineering Group, Arm

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