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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
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FEATURED PRODUCTS

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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FEATURED PRODUCTS

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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FEATURED PRODUCTS

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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
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FEATURED PRODUCTS

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KR - Korea
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Taiwan - 繁體中文
  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • System Design and Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Formal and Static Verification
          • Emulation
          • Planning and Management
          • FPGA-Based Prototyping
          • Simulation
          • Software-Driven Verification
          • System-Level Verification IP
          • Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Z1 Enterprise Emulation Platform
          • Protium X1 Enterprise Prototyping Platform
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • Flows
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • 솔루션
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
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        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
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      • Training
        • Custom IC / Analog / RF Design
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        • Digital Design and Signoff
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        • Tensilica Processor IP
      • Support
        • Support Process
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RF / Microwave Design

Circuit, system, and EM simulation for
RF/microwave product development

  • Related Products

    • EMX Planar 3D Solver
    • Virtuoso RF Solution
    • AWR Design Environment Platform
    • AWR Microwave Office
    • AWR VSS Software
    • AWR AXIEM Analysis
    • AWR Analyst Software
    • AWR What's New

Cadence Custom IC and PCB VP Glen Clark Discusses AWR Acquisition

Read Now

To meet the high-performance and reduced footprint requirements for multi-mode/multi-band handsets, wireless smart devices, and aerospace systems, companies are differentiating themselves by developing best-in-class RF/microwave IP. Whether these products are MMIC-based or tightly integrated into a PCB and/or multi-functional module, designers of RF/microwave front-end electronics require specialized design and simulation capabilities to meet aggressive performance targets.

RF/microwave devices are defined by unique performance metrics, impacted by operating conditions, such as frequency, input power, bias and modulation waveform, temperature, and terminal impedances. In addition to operating conditions, performance is largely driven by the physical layout of the design itself, requiring a tight coupling between electrical and physical design.

Our RF/microwave design tools, such as the Cadence® AWR Design Environment® platform, AWR® Microwave Office® software, AWR Visual System Simulator™ (VSS) communications and radar systems design software, AWR AXIEM® 3D Planar EM Analysis, and AWR Analyst™ 3D FEM EM analysis, address these challenges with electrical/physical co-design through RF-aware device models, electromagnetic (EM) analysis along with specialized circuit simulation technology, and design support aids. RF product development also may require system-level analysis to simulate the behavior within a radar and communications link.

  • AWR Design Environment platform – Design platform provides RF/microwave engineers with integrated high-frequency circuit, system, and EM simulation technologies and design automation to develop physically realizable electronics ready for manufacturing
  • AWR Microwave Office software – Circuit design software with intuitive interface, innovative design automation, and powerful harmonic-balance circuit simulation ensure greater engineering productivity and accelerated design cycles
  • AWR VSS software – RF/wireless communications and radar system design software supports VSWR-aware modeling of RF and DSP blocks, providing time-domain, frequency-domain, and circuit-envelope analyses
  • AWR AXIEM analysis – 3D planar method-of-moments (MoM) EM analysis simulator addresses passive structures, transmission lines, large planar antennas, and patch arrays. AWR AXIEM analysis delivers the accuracy, capacity, and speed designers need to characterize and optimize passive components on RF PCBs, modules, LTCCs, MMICs, RFICs, and antennas
  • AWR Analyst software – 3D finite-element method (FEM) EM simulation and analysis software accelerates high-frequency product development from early physical design characterization through to full 3DEM verification. The advanced solver technology provides fast and accurate analysis of the 3D structures/interconnects found in today's complex high-frequency electronics
  • AWR What's New – Offers new and enhanced technologies that provide greater design efficiency and first-pass success to engineering teams developing or integrating III-V ICs, multi-technology modules, and PCB assemblies for 5G, automotive, and aerospace/defense applications

At the IC level, our advanced EM simulation tool, the Cadence EMX® Planar 3D Solver, allows designers to accurately and efficiently simulate large RF circuit blocks, characterize the behavior of passive components, and analyze the parasitics due to interconnect. The easy-to-use EMX Planar 3D Solver shortens design cycles and helps bring to market substantially better products with less risk. It seamlessly integrates with the Cadence Virtuoso® and Spectre® platforms. The simulator has been extensively used by foundries as the “golden” reference tool for IC characterization of passive components.

Full RF Shield

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