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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Embedded Software

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Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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KR - Korea
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Taiwan - 繁體中文
  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • Flows
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • 솔루션
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
      • Support
        • Support Process
        • Online Support
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        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
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        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
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        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
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        • System Design and Verification
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        • Support Process
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What's New in Sigrity Technology 2017

New products, updated features, and purchasing options

  • What's New in Sigrity
  • Sigrity 2017
  • Sigrity 2016

Sigrity 2017 Portfolio Improves Product Creation Time with Enhanced PCB Design and Analysis Methodology and ESD Analysis Workflow

Cadence expanded its Sigrity™ technology portfolio with new capabilities:

  • Upgraded power delivery network (PDN) design and analysis flow to accelerate the time to product creation
    • New Allegro® PowerTree™ environment for graphically viewing the logical PDN topology. Saved within the PowerTree user interface are source/sink definitions, discrete values, model names, net names, decoupling capacitor values, target impedance constraints, and more.
    • Using data stored in the PowerTree environment, design engineers are able to do early analysis (sanity checks) using schematic data to determine if the PDN topology/tree has been properly captured to meet the design criteria.
    • During the physical design stage, PowerTree data can be used to automate setup of both AC and DC power integrity analysis. Both power integrity experts and non-experts can benefit from the ability to perform pushbutton analysis. PCB layout designers can utilize the integrated HTML report files to determine exactly what changes need to be made during the design process. Experts will be able to quickly validate any design changes meeting the PDN specified requirements during the validation process.
      • Sigrity PowerDC™ technology
      • Sigrity OptimizePI™ technology
  • New electro-static discharge (ESD) workflow to test the impact of an ESD gun model on a design. Transient-voltage-suppression (TVS) diodes and their ability to clamp the voltage peak are included in the ESD simulation.
    • Sigrity SPEED2000™ technology
  • New Serial Link Compliance Kit for PCI Express® (PCIe®) 4.0 to confirm that the 16Gbps interface requirements are met.
    • Sigrity SystemSI™ technology
    • Sigrity PowerSI®  technology
    • Clarity 3D Solver
  • Optimized design flow between IC package designer and characterization engineer
    • New cross-probing between electrical performance assessment (EPA) analysis report file and the IC package designer’s editing canvas
      • Sigrity XtractIM™ technology

Sigrity Tech Tip: How PCB Designers Can Find and Fix Power Integrity Problems

DesignCon 2017: Learn about several highlights of the Sigrity 2017 portfolio

Videos

DDR4 Power-Aware Signal Integrity Adopting Serial Link Simulation Techniques

SiriusXM Simulates DDR3 Interfaces with Sigrity Tools

Nexus Interposers and Cadence Tools Enhance DDRx Designs

News ReleasesVIEW ALL
  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis 07/19/2018

  • Cadence Sigrity PowerDC Technology Supports Future Facilities' New Open Neutral File Format for Thermal Interoperability 03/19/2018

  • Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff 01/25/2017

  • Cadence Sigrity 2016 Portfolio Improves Product Creation Time with PCB Design and Analysis Methodology for Multi-Gigabit Interfaces 01/19/2016

Blogs VIEW ALL

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