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CADENCE CLOUD

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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IP

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System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • 솔루션
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
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        • Support Process
        • Online Support
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        • Computing Platform Support
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      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
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        • Technical Forums
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Sigrity PowerSI

Fast and accurate electrical analysis of full IC packages or PCBs

Read Datasheet Read 3D EM Datasheet
  • Overview
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  • Videos
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  • Support and Training

Key Benefits

  • Fast and accurate signal/power integrity and design-stage EMI analysis, S-parameter model extraction, and frequency domain simulation
  • Tried and proven technology and supports large designs 
  • Interfaces to Cadence and other vendor layout databases

To help you tackle increasingly challenging issues related to simultaneous switching noise, signal coupling, and target voltage levels, Cadence® Sigrity™ PowerSI® technology provides fast, accurate, and detailed electrical analysis of full IC packages or PCBs. It is cloud ready and can be used pre-layout to develop power- and signal-integrity guidelines, as well as post-layout to verify performance and improve a design without needing a prototype.

Using Sigrity PowerSI electromagnetic (EM) field solver technology, you can readily perform a broad range of studies to identify trace and via coupling issues, power/ground fluctuations caused by simultaneously switching outputs, and design regions that are under or over voltage targets. PowerSI technology also lets you perform extraction of frequency-dependent network parameter models and lets you visualize complex spatial relationships.

Features
  • Facilitates AC analysis to assess voltage distribution across ground planes
  • Establishes power delivery network (PDN) guidelines for IC packages and boards
  • Evaluates electromagnetic coupling between geometries to enable better component, via, and decap placement
  • Extracts frequency-dependent S, Z, and Y parameters for package and board modeling for subsequent time domain SSN simulation
  • Anticipates energy leaks with near-field ration display
  • Assesses decoupling capacitor strategies and verifies placement effects Enables broadband modeling including accurate DC performance characterization (patent pending)
  • Integrates seamlessly with 3D solutions for IC packages and boards
  • Distributed computing option accelerates analysis time (additional license required)
  • Strong HSPICE flow support
  • Optimized for flows with Cadence SiP Layout, Allegro® Package Designer, and Allegro PCB Designer
  • Readily used in Mentor, Zuken, and Altium flows, accepting a mix of CAD databases where needed for multi-structure design support

Contact Us

See how Nexus Technology runs “what-if” cases using the Sigrity PowerSI tool to gain insights that lead to useful changes in trace widths, impedance, and more.

EM ANALYSIS: Why, When, and What?

Read Technical Brief
  • Related Products

    • Clarity 3D Solver
    • Sigrity Advanced SI
    • Sigrity Advanced PI
  • Related Information

    • IO-SSO Analysis Suite
Resource Library

Conference Paper (10)

  • A Fast Evaluation of Power Delivery System Input Impedance of Printed Circuit Boards with Decoupling Capacitors Conference Paper
  • Effect of Power Noise on Multi-Gigabit Serial Links Conference Paper
  • A Resonance-Free Power Delivery System Design Methodology Applying 3D Optimized Extended Adaptive Voltage Positioning Conference Presentation
  • Timing Skew Enabler Induced by Fiber Weave Effect in High Speed HDMI Conference Paper
  • Efficient Methodology for Modeling Structure of High-Speed Long Transmission Lines Conference Paper
  • Baseband IC Design Kits for Rapid System Realization
  • Channel Based Methods for Signal Integrity Evaluation Conference Paper
  • Power Integrity Conference Paper
  • Broadband Methodology for Power Distribution System Analysis of Chip, Package and Board for High Speed IO Design Conference Paper
  • Power Integrity in System Design Conference Paper

Press Releases (9)

  • Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology
  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis
  • Cadence Supports New TSMC WoW Advanced Packaging Technology
  • Cadence Sigrity PowerDC Technology Supports Future Facilities' New Open Neutral File Format for Thermal Interoperability
  • Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS® 3D Packaging Technologies
  • Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff
  • Cadence Sigrity 2016 Portfolio Improves Product Creation Time with PCB Design and Analysis Methodology for Multi-Gigabit Interfaces
  • Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers' Design Cycle by Up to 12 Weeks
  • Cadence Expands Sigrity 2015 Technology Portfolio with New Products, a Key Feature Update and Flexible Licensing Options

Presentation (3)

  • Enabling Accurate and Efficient 3D Full-Wave Extraction for 3D Experts and Non-Experts Presentation
  • Learn How to Turn Simulation into Reality for PAM4 Analysis Presentation
  • How to Efficiently Analyze a DDR4 Interface

Article (1)

  • A review of PCB-level Power Delivery System

Video (10)

  • Cadence Solves the Challenges Faced by Mobiveil Technologies Hardware Group
  • Seagate Uses Cadence Allegro and Sigrity PCB Tools to Develop Next-Generation Solid-State Drives
  • DesignCon 2017: Sigrity 2017 Portfolio Highlights
  • Sigrity Tech Tip: How to Accelerate Accurate 3D Full Wave Extraction Time
  • DesignCon 2015: Sigrity 2015 Portfolio Highlights
  • Sigrity Tech Tip: How to Build Accurate Leadframe Package Models Quickly and Easily
  • Sigrity Tech Tip: How to Accurately Model a Multi-Gigabit Serial Link 10 Times Faster
  • DDR4 Power-Aware Signal Integrity Adopting Serial Link Simulation Techniques
  • Lattice Saves Millions, Avoids Respins and Product Delays with Sigrity Tools
  • Shorten EMI Testing Time on PCB Designs

Success Story Video (3)

  • Seagate Uses Cadence Allegro and Sigrity PCB Tools to Develop Next-Generation Solid-State Drives
  • Lattice Saves Millions, Avoids Respins and Product Delays with Sigrity Tools
  • Shorten EMI Testing Time on PCB Designs

White Paper (2)

  • Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages
  • Power-Aware Analysis Solution Whitepaper
VIEW ALL
Videos

Cadence Solves the Challenges Faced by Mobiveil Technologies Hardware Group

Seagate Uses Cadence Allegro and Sigrity PCB Tools to Develop Next-Generation Solid-State Drives

Sigrity Tech Tip: How to Accurately Model a Multi-Gigabit Serial Link 10 Times Faster

DDR4 Power-Aware Signal Integrity Adopting Serial Link Simulation Techniques

Lattice Saves Millions, Avoids Respins and Product Delays with Sigrity Tools

Shorten EMI Testing Time on PCB Designs

News ReleasesVIEW ALL
  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis 07/19/2018

  • Cadence Sigrity PowerDC Technology Supports Future Facilities' New Open Neutral File Format for Thermal Interoperability 03/19/2018

  • Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff 01/25/2017

  • Cadence Sigrity 2016 Portfolio Improves Product Creation Time with PCB Design and Analysis Methodology for Multi-Gigabit Interfaces 01/19/2016

  • Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers' Design Cycle by Up to 12 Weeks 12/01/2015

Blogs VIEW ALL
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