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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
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  • Power Analysis
  • Constraints and CDC Signoff
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  • Library Characterization
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FEATURED PRODUCTS

  • Cerebrus Intelligent Chip Explorer
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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

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Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

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FEATURED PRODUCTS

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
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  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
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  • Fidelity CFD
  • Sigrity Advanced SI
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  • RESOURCES
  • System Analysis Center
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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
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  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / Machine Learning

AI IP Portfolio

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Technologies

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  • Functional Safety
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
See how our customers create innovative products with Cadence

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Training

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KR - Korea
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Taiwan - 繁體中文
  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • Flows
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • 솔루션
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
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        • Custom IC / Analog / RF Design
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        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
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        • Support Process
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Celsius PowerDC

Ensure reliable power delivery

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Key Benefits

  • Thermal-only flow
  • CFD ready
  • Ensures reliable power delivery
  • Lowers costs, reduces delays, and prevents field failures
  • Provides conclusive IR drop analysis for package and board

To ensure you achieve reliable power delivery, Cadence® Celsius™ PowerDC™ technology provides efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation to maximize accuracy. PowerDC technology quickly pinpoints excessive IR drop, along with areas of excess current density and thermal hotspots to minimize your design’s risk of field failure.

Image of DC analysis showing different layers of PCB in Cadence Sigrity PowerDC environment
DC analysis shows different layers of the PCB and the amount of voltage drop across the board

 

Features

  • Automatically set-up DC simulations using PowerTree™ data (source/sink definitions) captured at the schematic stage of the design process
  • Identifies difficult-to-locate highly resistive routing neck-downs and finds the one via among thousands that will fail under stress
  • Determines if it is possible to reduce plane layers without adding DC or thermal reliability risk
  • Assesses multi-structure PCB and package designs along with chip-level information
  • Considers what-if improvement options with a unique block-diagram results view, and a range of visualization options,
  • Easy-to-deploy workflow that is ideal for occasional users and experts alike
  • Patented automation to pinpoint the best remote sense line location
  • Highly accurate, even for complex designs with multiple voltage domains and complex plane structures
  • Comprehensive support for multi-structure designs including stacked die, multiple boards, and all popular package types
  • Visualize the power portion of your schematics with PowerTree data
  • Run pre-layout simulation without copper using PowerTree data to help select components that meet design criteria
  • Optimized for flows with Allegro® Package Designer Plus and its SiP Layout Option, and Allegro PCB Designer
  • Readily used in Mentor, Zuken, and Altium flows, accepting a mix of CAD databases where needed for multi-structure design support

Contact Us

Seagate’s Story: Seagate reduces IR drop, accelerates review cycles, and lowers cost

  • Related Products

    • Sigrity Aurora
    • Celsius Advanced PTI
    • Clarity Extraction
    • Sigrity OptimizePI
    • Sigrity PowerSI | Cadence
    • Clarity 3D Solver
    • Celsius Thermal Solver
Videos

DesignCon 2017: Sigrity 2017 Portfolio Highlights

Sigrity Tech Tip: How PCB Designers Can Create Initial PDN Constraints Without Becoming a PI Expert

Sigrity Tech Tip: How PCB Designers Can Find and Fix Power Integrity Problems

Multi-Board Electrical and Thermal Co-simulation using Sigrity PowerDC

News ReleasesVIEW ALL
  • Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology 10/17/2019

  • Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology 04/23/2019

  • Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies 10/02/2018

  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis 07/19/2018

  • Cadence Supports New TSMC WoW Advanced Packaging Technology 05/01/2018

Blogs VIEW ALL
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