IC Package Design

Cadence^® Allegro^® Package Designer Plus and OrbitIO^™ Interconnect Designer provide world-class cross-domain design planning, optimization, and layout platforms for single-die and multi-die advanced packages and modules. The complexity and performance requirements of today's semiconductor packages continue to increase while design resources remain static for most organizations—placing a premium on efficiency and productivity. Cadence package implementation products deliver the automation and accuracy to expedite the design process as part of a comprehensive environment, including comprehensive electrical and thermal analysis as well as IC/package co-design.