Chip / Package Co-Design
Create higher performing, lower cost packages
Multi-Chip(let) Design
Robust support for multi-chip(let) heterogeneously integrated designs
Comprehensive Design
Analysis and verification flow for fan-out wafer-level package (FOWLP)
Reference Flows
Support for major foundry and OSAT advanced packaging
White Paper
Chiplets and Heterogeneous Packaging Are Changing System Design and Analysis
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Video
Lightelligence Powers the Next Generation of Innovations Using Integrity 3D-IC Platform
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Video
Cadence IC Design Online Training Bootcamp 1: Circuit Design/Simulation/Result Check
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