Proven electronic system design for Aerospace and National Defense
Invest for the future. You can't do 5G, AI, and machine learning without Cadence
Cadence has a full array of verification, digital design, and custom design tools, IP, and methodologies. By working closely with us, you can develop trusted, future-proof FPGA and ASIC designs using solutions that your commercial electronics counterparts have been relying on for more than 25 years. With our tools that co-verify the hardware and software design and operation, you can discover anomalies much earlier in the design phase and be on your way to achieving first-pass success.
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First pass success for future proofed electronics
You can't do chip/system design without Cadence
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Learn the latest chip design tools and methodologies
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First Pass success for future proofed electronics
Cadence is the leader and your trusted partner to help you design electronic systems that are:
- future proofed, on budget, on schedule, sustainable and modernizable
Our portfolio includes:
- Design tools proven on complex, advanced-node, and sensitive programs on a wide variety of process nodes, including the smallest geometries currently in use
- Hardware platforms that accelerate the design process with over 20 use models for verification and analysis
- Verification IP to speed industry-standard compliance testing
- Design IP proven in silicon, from small blocks to complex interfaces and configurable processors
- Services team to assist in the design process, with experience in ITAR and other sensitive programs
- Broad and deep ecosystem of partners for broader solution platforms
- Professional education and training for all aspects of electronics system design to help augment and raise your team’s capabilities and reduce risk
- DO-254 certified personnel, compliant flow development experience, and project management expertise
Learn the Latest chip design tools and methodologies
- Develop and maintain advanced SoC design and verification expertise
- Manage long SoC development schedules and minimize risk of respins
- Mitigate risks posed by inadequate verification methodologies
- Address software integration challenges and time
- Analyze multi-fabric chip/package/board designs
- Explore the high-level concepts and activities within the DO-254.
AI,5G,Digital Twinning, Embedded Software
Our technology experts explain how
Our job is helping customers design sophisticated silicon, which is becoming more and more complex.
Lip-Bu Tan
Chief Executive Officer
We’ve been leading the industry in the development, deployment, and support of electronic design flows that use machine learning, analytics, and optimization technologies.
Anirudh Devgan
President
Our job is helping customers design sophisticated silicon, which is becoming more and more complex.
Lip-Bu Tan
Chief Executive Officer
We’ve been leading the industry in the development, deployment, and support of electronic design flows that use machine learning, analytics, and optimization technologies.
Anirudh Devgan
President
Cadence Selected for Machine Learning Contract by DARPA
Emulate before you fabricate for first-pass success, future-proofed digital twinning