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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows
  • Voltus IC Power Integrity Solution

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
  • Virtual Prototyping
  • Emulation and Prototyping
  • Static and Formal Verification
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Denali Memory Interface and Storage IP
  • 112G/56G SerDes
  • PCIe and CXL
  • Tensilica Processor IP
  • Chiplet and D2D
  • Interface IP

RESOURCES

  • Discover PCIe

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • Flows
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools

Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / Machine Learning

AI IP Portfolio

Industries

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Technologies

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  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
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Support

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Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
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KR - Korea
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Taiwan - 繁體中文
  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • Flows
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • 솔루션
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
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Solutions

Comprehensive Solutions and Methodologies

Your design challenges involve much more than a point-tool solution. That's why Cadence works on solutions for your most challenging problems at a sub-system or system level. You can benefit from the work we've done by exploring the sections below.

3D-IC Design

Enabling maximum functionality in a small form factor

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5G Systems and Subsystems

Proven IP and design tools to speed challenging 5G designs

LEARN MORE

Advanced Node

Proven design flows at 10nm and below

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Aerospace and Defense

Helping you achieve first-pass success

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AI / Machine Learning

Enabling faster, smarter design solutions and product differentiation

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Arm-Based Solutions

Making whole systems possible

LEARN MORE

Automotive Solutions

Making cars safer and more reliable

LEARN MORE

Cadence Cloud Portfolio

The future of electronic design

LEARN MORE

FPGA Development

Comprehensive Flow for Complex FPGAs

LEARN MORE

Hyperscale Computing

Enabling compute from sensors through edges to the data center

Learn More

Low Power

Every step of the design flow optimized for power

LEARN MORE

Mixed Signal

Comprehensive, interoperable, and proven verification and implementation

LEARN MORE

Photonics

Integrated design automation environment

LEARN MORE

RF/Microwave Solutions

Enabling the development of high-performance front-end components for wireless systems

Learn More
Customers

Due to the Palladium Z1 platform's capacity to handle our billion gate-class designs and its highly sophisticated debug and advanced multiuser capabilities, all in a small form factor, we will be able to design and deliver our next generation GPU and Tegra designs with high quality and on schedule.

Narenda Konda, Director of Engineering, NVIDIA

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Processors for automotive and industrial markets are driving higher levels of integration and complexity. This requires larger design partitions to deliver the efficiencies and time to market demanded by our customers.

Anthony Hill, Director of Processor Technology, Texas Instruments

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Electrically aware design can enable us to save several iterations on the design of each block sensitive to parasitic effects. Depending on block complexity, design time savings can range from half a day to several days per block.

Martin Kejhar, Senior Technical Staff Engineer and Scientist, ON Semiconductor

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