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Cadence and Uhnder—Partnering to Make Fully Autonomous Driving Possible
Discover how Uhnder created the world’s first digital radar chip, an impossible task without tools from Cadence. “Together we’re going to save millions of lives,” says Manju Hegde, CEO and cofounder of Uhn...
06 Dec 2019
Israeli HiPer Consortium N16 Tapeout with Pegasus
The ENICS SoC Lab at Bar Ilan University tapedout the Israeli HiPer Consortium N16 chip (members include: Mellanox, Ceva, DSP Group, Satixfy, Ceragon, Sonics, others…) and signed-off the design using Caden...
02 Dec 2019
True 3D EM Modeling Enables Fast, Accurate Analysis
Tired of patchwork 3D EM analysis? Impedance discontinuity can destroy your BER and cause multiple design iterations. Using today’s 3D EM modeling tools can take you days to accurately model the interconne...
27 Nov 2019
True 3D System Analysis with Faster Speeds, More Capacity, and Integration
Learn about how the new cloud-ready Clarity™ 3D Solver lets you optimize your design for true 3D system analysis. This electromagnetic (EM) solver addresses complex 3D structures on chips, packages, and PC...
27 Nov 2019
TI Verification Expert Shares Their PSS UVM Synergy Experience
Liran Kosovizer, a TI verification manager, is a highly experienced, advanced user of UVM-e and Cadence® Specman® Elite. Liran believes in automation, structured processes, and reuse. While making the best...
20 Nov 2019
Cadence Training Methodology
This video provides a short general overview of the main Cadence Training options and learning methods including: online (ILS) courses, live (ILT) training, Training Byte videos, and learning maps per tech...
07 Nov 2019
Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver
This demonstration of Celsius Thermal Solver shows how easy it is to perform highly-accurate electrical-thermal co-simulation.  Steady-state and transient simulations are performed as well as heat transfer...
24 Oct 2019
Announcing Celsius Thermal Solver, a New Approach to System-Level Thermal Analysis
In this week's Whiteboard Wednesdays video, Ben Gu introduces Celsius™ Thermal Solver, a new tool employing finite element analysis (FEA) techniques for thermal analysis of electronic systems.  Ben explain...
23 Oct 2019
Rambus Verifies GDDR6 High-Speed Memory PHY IP Using Cadence VIP
Learn how Cadence memory model Verification IP (VIP) helped Rambus with the verification of their memory subsystems allowing them to meet their time to revenue targets.
23 Oct 2019
System of Systems Verification and Digital Twins for Aerospace Applications
Frank Schirrmeister from Cadence Design Systems presents in the US Pavillion at the 53rd Paris International Airshow on 20th June 2019 promoting Cadence solutions for Intelligent System Design in Aerospace...
17 Oct 2019
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