Home
  • 제품소개
  • 솔루션
  • 기술지원 및 교육
  • 회사소개
  • KO KR
    • SELECT YOUR COUNTRY OR REGION

    • US - English
    • China - 简体中文
    • Japan - 日本語
    • Taiwan - 繁體中文

DESIGN EXCELLENCE

  • Digital Design and Signoff
  • Custom IC
  • Verification
  • IP
  • IC Package

SYSTEM INNOVATION

  • System Analysis
  • Embedded Software
  • PCB Design

PERVASIVE INTELLIGENCE

  • AI / Machine Learning
  • AI IP Portfolio

CADENCE CLOUD

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

  • Logic Equivalence Checking
  • Innovus Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test
  • Flows
  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
  • Address digital implementation challenges with machine learning Watch Now

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions
  • Flows
  • Solve analog simulation challenges in complex designs Watch Now
  • See how the Virtuoso Design Platform addresses advanced custom IC and system design challenges Watch Now

System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

  • Debug Analysis
  • Emulation
  • Formal and Static Verification
  • FPGA-Based Prototyping
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP
  • Flows
  • Prototype your embedded software development Watch Now
  • Learn how early firmware development enabled first silicon success at Toshiba Memory Watch Now

IP

An open IP platform for you to customize your app-driven SoC design.

  • Interface IP
  • Denali Memory IP
  • Tensilica Processor IP
  • Analog IP
  • System / Peripherals IP
  • Verification IP
  • Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
  • Meeting the needs of 5G communication with Tensilica® ConnX B20 DSP IP Download Now

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows
  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions
  • System Analysis Resources Hub

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • What's New in Allegro
  • What's New in Sigrity
  • RF / Microwave Design
  • Flows
  • Advanced PCB Design & Analysis Blog
  • Watch how to easily tackle complex and cutting edge designs. Learn More
  • Learn why signal integrity analysis needs to be power-aware Watch Now
  • Augmented Reality Lab Tools

AI / Machine Learning

AI IP Portfolio

INDUSTRIES

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • AI / Machine Learning

TECHNOLOGIES

  • 3D-IC Design
  • Advanced Node
  • Arm-Based Solutions
  • Cloud Solutions
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
See how our customers create innovative products with Cadence Explore Now

SUPPORT

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

TRAINING

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Stay up to date with the latest software Download Now
24/7 - Cadence Online Support Visit Now

CORPORATE

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

MEDIA CENTER

  • Events
  • Newsroom
  • Blogs

CULTURE AND CAREERS

  • Culture and Diversity
  • Careers
Learn how Intelligent System Design™ powers future technologies Learn More
Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
View all Products
  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • 솔루션
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • 회사소개
      • CORPORATE
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • MEDIA CENTER
        • Events
        • Newsroom
        • Blogs
      • CULTURE AND CAREERS
        • Culture and Diversity
        • Careers
      • CORPORATE
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • MEDIA CENTER
        • Events
        • Newsroom
        • Blogs
      • CULTURE AND CAREERS
        • Culture and Diversity
        • Careers
      • CORPORATE
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • MEDIA CENTER
        • Events
        • Newsroom
        • Blogs
      • CULTURE AND CAREERS
        • Culture and Diversity
        • Careers
      • CORPORATE
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • MEDIA CENTER
        • Events
        • Newsroom
        • Blogs
      • CULTURE AND CAREERS
        • Culture and Diversity
        • Careers

  • Home
  •   :  
  • About Us
  •   :  
  • Newsroom
  •   :  
  • Press Releases
  •   :  
  • 05 Nov 2020

Cadence Expands Computational Software Development with Opening of New European R&D Centre of Excellence in Cork, Ireland

Company plans to bring approximately 150 engineering positions to the region over next three years

CORK, Ireland, 05 Nov 2020

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the opening of a new European R&D Centre of Excellence in Cork, Ireland, to further expand local computational software development. Over the next three years, Cadence expects to create approximately 150 new engineering positions in Cork, facilitating customer design advancement in emerging consumer, hyperscale computing, 5G communications, automotive, aerospace, industrial, mobile and healthcare application areas.

An Taoiseach, Micheál Martin, said, “The Cadence decision to establish a state-of-the-art R&D Centre of Excellence in Cork is a positive addition to the vibrant and expanding technology industry in Cork. We are pleased to welcome Cadence’s R&D presence in Cork as part of the local technology ecosystem, and we look forward to the centre providing significant employment opportunities for local residents with strong technology backgrounds. The Cork R&D Centre of Excellence also demonstrates Cadence’s commitment to both Cork and Ireland as a premier place to do business as evidenced by the growing size and scope of Cadence’s Irish operations.”

Cadence already has a well-established Shared Services Centre (SSC) in Dublin, Ireland with senior finance, engineering and IT roles, and the new Cork site broadens the companys international presence and its role as Cadence’s international headquarters. The company plans to accelerate hiring in Cork immediately. For more information on the local openings, please visit our careers site at www.cadence.com/go/corkcareerspr.

Anirudh Devgan, president of Cadence, said, “The Cork R&D Centre of Excellence reflects Cadence’s continued commitment to expand its presence in Ireland. Cadence began operations in Ireland in 1997 and has a long and successful history in the region. The Cork R&D Centre of Excellence further increases the size, scope and capabilities of our international headquarters in Ireland. We look forward to the Cork R&D Centre of Excellence employees becoming a part of the global team developing leading-edge software and other solutions for Cadence, which will assist our customers in meeting their Intelligent System Design challenges now and in the future.”

Steven Hollands, software engineering group director and Cork site leader, Cadence, said, “The timing and scale of this Cadence investment is a real boost to Cork’s growing reputation as a specialised R&D hub. Due to our proximity to the University College Cork and the Cork Institute of Technology as well as to Ireland’s largest ICT research centre, The Tyndall Institute, we have an amazing engineering and computer science talent pool to draw from who can join us in our mission of shaping the future of technology by driving design excellence through our Intelligent System Design strategy.”

The opportunities to do meaningful, high-impact work across many technology verticals is one of the reasons Cadence has been recognized by the Great Place to Work Institute as a Best Workplace in Ireland for the past six years, in addition to global recognition as a Best Workplace in Europe, a World’s Best Workplace and one of Fortunes 100 Best Companies to Work For. The inclusion of Cadence on these lists reflects its dynamic and inclusive company culture in Ireland and across the globe, where employees are passionate about solving technology’s toughest challenges.

Tanaiste & Minister for Enterprise Trade & Employment, Leo Varadkar, said, “I’d like to take the opportunity to welcome Cadence to Cork. The company’s plans to establish their European R&D Centre of Excellence and employ 150 people over the next three years is a great boost. I wish the company every success.”

CEO of IDA Ireland, Martin Shanahan, said, “Today’s announcement by Cadence further strengthens the South West region’s expanding cluster of microelectronics and semiconductor-related companies. Cadence’s new R&D Centre and the 150 highly skilled engineering roles that they plan to recruit present significant opportunity. I wish to congratulate Cadence on this announcement and wish them every success with this expansion.”

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For six years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

For more information, please contact:

Cadence Newsroom
408-944-7039
newsroom@cadence.com

Alison Nulty
Regional Communications Executive, IDA Ireland
+353 (0) 87 349 2590
alison.nulty@ida.ie

© 2020 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Media Contacts

For more information, please contact:

Cadence Newsroom

408.944.7039

newsroom@cadence.com

A Great Place to Do Great Work!

Sixth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • General Inquiry
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2021 Cadence Design Systems, Inc. All Rights Reserved.

Terms of Use Privacy US Trademarks
Connect with us