Home
  • 제품소개
  • 솔루션
  • 기술지원 및 교육
  • 회사소개
  • KO KR
    • SELECT YOUR COUNTRY OR REGION

    • US - English
    • China - 简体中文
    • Japan - 日本語
    • Taiwan - 繁體中文

DESIGN EXCELLENCE

  • Digital Design and Signoff
  • Custom IC
  • Verification
  • IP
  • IC Package

SYSTEM INNOVATION

  • Multiphysics System Analysis
  • Embedded Software
  • PCB Design
  • Computational Fluid Dynamics

PERVASIVE INTELLIGENCE

  • AI / Machine Learning
  • AI IP Portfolio

CADENCE CLOUD

VIEW ALL PRODUCTS

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows
  • Voltus IC Power Integrity Solution

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
  • Virtual Prototyping
  • Emulation and Prototyping
  • Static and Formal Verification
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Denali Memory Interface and Storage IP
  • 112G/56G SerDes
  • PCIe and CXL
  • Tensilica Processor IP
  • Chiplet and D2D
  • Interface IP

RESOURCES

  • Discover PCIe

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • Flows
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools

Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / Machine Learning

AI IP Portfolio

Industries

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • Hyperscale Computing

Technologies

  • 3D-IC Design
  • Advanced Node
  • AI / Machine Learning
  • Arm-Based Solutions
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
Designed with Cadence See how our customers create innovative products with Cadence

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Link for support software downloads Stay up to date with the latest software 24/7 - Cadence Online Support Visit Now

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

Media Center

  • Events
  • Newsroom
  • Blogs

Culture and Careers

  • Culture and Diversity
  • Careers
Intelligent System Design Learn how Intelligent System Design™ powers future technologies Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
KR - Korea
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Taiwan - 繁體中文
  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • Flows
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • 솔루션
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • 회사소개
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers

  • Home
  •   :  
  • About Us
  •   :  
  • Newsroom
  •   :  
  • News Releases
  •   :  
  • 12 Nov 2013

Cadence Introduces Voltus IC Power Integrity Solution, Delivering Exceptional Performance and Capacity in Power Signoff

SAN JOSE, Calif., 11 Nov 2013

Highlights:
  • New power integrity analysis engine with massively parallel execution brings up to 10X faster performance
  • New hierarchical architecture supports very large designs up to 1 billion instances
  • Tightly integrated with key Cadence tools throughout the design flow, including Cadence Tempus Timing Signoff Solution, for the fastest design closure in the industry
  • TSMC certified Voltus technology for its 16nm FinFET process in IR-drop analysis accuracy and EM rule compliance
Addressing the critical power challenges faced by electronics developers, Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced Voltus™ IC Power Integrity Solution, delivering record performance and capacity power analysis to meet the needs of next-generation chip design . Voltus IC Power Integrity Solution draws on unique new technology as well as integration with Cadence® IC, package, PCB and system tools to enable design teams to better manage power issues throughout the product development cycle and achieve faster design closure.

"As a global leader in embedded processing semiconductor solutions, Freescale is always on the lookout for new design tools that help us innovate and create at the most advanced levels of technology," said Ken Hansen, vice president and chief technology officer at Freescale Semiconductor. "We are teaming early on with Cadence to validate the Voltus technology and we are impressed by its performance gains. This type of enhanced productivity is invaluable to help us meet our time-to-market goals."

Following the May release of Tempus™ Timing Signoff Solution, the Voltus solution marks the second major new product this year from Cadence aimed at speeding design signoff and closure. Using the Voltus solution, Cadence customers can shrink the critical power signoff closure and analysis phase to a minimum through key capabilities including:
  • A new massively distributed parallel power integrity analysis engine that delivers a scalable performance gain up to 10X over competing products
  • A hierarchical architecture that, coupled with the parallel execution, scales to multiple CPU cores and servers, enabling the analysis of designs of up to a billion instances
  • SPICE-accurate solver technology that provides the most accurate power signoff results
  • Physically-aware power integrity optimization, such as early rail analysis, de-coupling cap and power gating switches, that improves physical implementation quality and speeds up design closure
Voltus IC Power Integrity Solution delivers these capabilities as a standalone product, but provides even greater benefits when integrated with other Cadence tools:
  • The industry's first unified electrical signoff solution for faster, converged timing and power signoff, when used with Tempus Timing Signoff Solution
  • A unique and comprehensive power integrity solution encompassing chip, package and PCB when combined with Encounter® Digital Implementation System and Allegro® Sigrity™ Power Integrity
  • Analysis of custom/analog IP in an analog mixed-signal SoC design when integrated with Virtuoso® Power System
  • Accurate IC chip power integrity analysis, driven by real-world power stimulus when used with Palladium® Dynamic Power Analysis functionality
"With power issues playing an ever-growing role in SoCs, we realized that existing technology would not meet the needs for complex designs," said Anirudh Devgan, Senior Vice President of the Digital and Signoff Group (DSG) at Cadence. "Voltus IC Power Integrity Solution is Cadence's answer to these challenges, and all our early adopters are reporting great successes on its performance and capacity, including on-time tapeout for one of the industry's largest chips."

The Voltus technology is certified by TSMC for the foundry's 16nm FinFET manufacturing process (Design Rule Manual version 0.5). By meeting TSMC's EDA tool certification criteria, the Voltus solution will enable customers to achieve accurate IR-dropanalysis and EM results. The criteria included meeting accuracy requirements for advanced node design rules, static and dynamic IR-drop analysis and very complex electro-migration rules. Cadence is working with TSMC to complete certification for Design Rule Manual version 1.0

Availability
Voltus IC Power Integrity Solution is available now. Cadence will showcase the Voltus capabilities at the Signoff Summit on Nov. 21 at Cadence headquarters in San Jose, Calif. For more information about the Signoff Summit, please click here. For more information about Voltus IC Power Integrity Solution, visit the Cadence website at www.cadence.com/news/voltus.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

For more information, please contact:
Cadence Newsroom
408-944-7226
newsroom@cadence.com


© 2013 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Encounter, Allegro, Virtuoso and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Media Contacts

For more information, please contact:

Cadence Newsroom

408.944.7039

newsroom@cadence.com

Fortune 100 Best Companies to Work for 2022

A Great Place to Do Great Work!

Eighth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • General Inquiry
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2022 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • US Trademarks