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Digital Design and Signoff
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Custom IC / Analog / RF Design
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
An open IP platform for you to customize your app-driven SoC design.
IC Package Design and Analysis
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Multiphysics System Analysis
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
PCB Design and Analysis
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
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19 Jan 2022
Tensilica Vision Q7 DSP enables Light’s Clarity Depth Perception Platform to power next-generation ADAS systems with 10X greater performance than quad-core CPU
13 Jan 2022
14 Dec 2021
07 Dec 2021
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Ambarella keeps pace with the shrinking window of opportunity by accelerating their design process and minimizing time to market by using the Cadence Clarity 3D Solver.
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