| 16 Dec 2019 - 18 Dec 2019 |
Hear Taylor Hogan of Cadence present his keynote on AI, and visit the Cadence booth, where we’ll introduce you to the latest tools, methodologies, and support you need to improve your electromagnetic, electronic, and thermal designs, as well as the electromechanical simulation needed to address these system issues.
Event Detail
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Kaohsiung, Taiwan |
| 07 Jan 2020 - 11 Jan 2020 |
Meet with key Cadence business and technology leaders to hear about Tensilica products for consumer, automotive and industrial markets and see exciting demonstrations. Find out how Tensilica AI at the edge processors and specialized DSPs can make an impact in your next SoC design, giving you the highest performance and lowest power for your new innovations.
Event Detail
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Las Vegas, NV, USA |
| 28 Jan 2020 - 30 Jan 2020 |
Visit us at DesignCon in Booth 711 to see how you can improve your electromagnetic, electronic, and thermal designs with system analysis, tackle advanced IC packaging and cross-platform challenges, and successfully incorporate photonic ICs and designs with 112G SerDes and advanced DDR IP. Learn from our customers, partners, and Cadence experts in our new booth theater.
Event Detail
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Santa Clara, CA, USA |
| 24 Feb 2020 - 27 Feb 2020 |
Are you designing an edge AI, vision, audio, radar, lidar, or communications product? Meet with Cadence at MWC Barcelona 2020 to hear how Tensilica processors and DSPs continue to innovate to keep your products ahead of the competition.
Event Detail
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Barcelona, Spain |
| 25 Feb 2020 - 27 Feb 2020 |
Visit Cadence at embedded world to learn more about how to make cars safer and more reliable. Cadence will showcase its latest Tensilica DSPs and design tools for automotive applications targeting ADAS, infotainment, ECU/automotive Ethernet design, and FPGA prototyping.
Event Detail
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Nuremberg, Germany |
