On-Demand CadenceCONNECT: Aerospace &​ Defense Systems Day

To achieve first-pass success, you need tools and methodologies that are future-proofed, on budget, on schedule, and sustainable and modernizable. Register today and become one step closer to success.​​

CadenceTECHTALK: Thermal Analysis for MMIC and RF PCB Power Applications

This webinar will highlight how the Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Cadence’s Microwave Office® software to provide designers with thermal heat map visualization and operating temperature information. By using the Celsius Thermal Solver with Microwave Office software, RF designers have access to critical data impacting performance and reliability concerns and can investigate heat sinking strategies to best manage thermal dissipation.

DesignCon Digital 2021

This all-new DesignCon Digital event features an education program with on-demand webinars presented by a standout speaker list, suppliers with easy-to-find products and services, and multiple matchmaking and networking opportunities—all with the quality who’ve come to expect from a DesignCon event. Cadence is a gold sponsor of the conference and will participate in a number of interactive activities including the industry webinar, a Digital Zone interview, and a virtual booth.

CadenceTECHTALK: Benefits of a Common Methodology for Emulation and Prototyping

Join our experts to understand why you should consider bridging emulation and prototyping into a continuous verification environment to speed up your verification throughput and for early software validation and real world testing.

Addressing Security Verification Requirements with JasperGold SPV App

Join Cadence experts to learn how the JasperGold Security Path Verification (SPV) App addresses today’s growing security challenges by analyzing functional SVA properties as well as secure path propagation properties.

CadenceLIVE Taiwan 2021

For the last several years, CadenceLIVE has brought together technology users, developers, and industry experts to connect, share ideas and best practices, and inspire design creativity. Attendees will have the opportunity to view exciting keynotes, attend interesting user presentations, and interact with Cadence® technology experts, peers, and our sponsors in our virtual Designer Expo. 

​CadenceLIVE China 2021​

CadenceLIVE China​ 2021 brings together Cadence technology users, developers, and industry experts to connect, share ideas and best practices, and inspire design creativity. ​

EPEPS Virtual 2021

Electrical Performance of Electronic Packaging and Systems Conference (EPEPS) is the premier international conference on advanced and emerging issues in electrical modeling, analysis, and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power, and thermal integrity in high-speed designs. Cadence is a Gold Sponsor of this event and will present a one-hour tutorial on the Clarity 3D Solver’s interposer flow and the challenges of 3D EM simulation.

Arm DevSummit 2021

Join Cadence at Arm DevSummit, a virtual event designed for software and hardware engineers. This three-day virtual conference serves up insights into the latest technology trends, gives you an opportunity to up-level your skills in technical sessions and hands-on workshops, and offers the chance to network with like-minded software developers and hardware designers.

CadenceTECHTALK: Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation

This webinar will showcase Cadence RF solutions support for design, analysis, and integration of antennas within manufacturing layout flows for PCB, module, and RFIC technologies. Examples will include surface-mount chip/antenna impedance matching with network synthesis, conformal integrated antenna analysis, antenna array in package/module design, and on-chip antenna design.