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Digital Design and Signoff
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
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Custom IC / Analog / RF Design
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
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Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
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An open IP platform for you to customize your app-driven SoC design.
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IC Package Design and Analysis
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
System Analysis
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
Embedded Software
PCB Design and Analysis
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
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DSP Concepts partnered with Cadence to create an AI-Optimized Audio framework for Cadence Tensilica HiFi processors.
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Learn how Dynamic Duo 2.0 is becoming a game-changer technology for NVIDIA.
Palladium and Protium help AMD push emulation in capacity, next-gen testbench design, advanced clocking, and hybrid use.
ETNZ engineers explain why simulation is key to winning this edition and defending the trophy.
Hailo’s leading-edge solution for AI used Cadence digital design and signoff technology.
Green Hills Software partners with Cadence to leverage their respective strengths.
Fugaku, the world’s most powerful supercomputer addressing Arm-based high-density and high-performance LSI requirements, designed with Cadence.
Ambarella keeps pace with the market by minimizing the design cycle using Clarity 3D Solver.
Ambarella performs fast and accurate 3D analysis of AI vision processors
Find out how BabbleLabs is creating a revolution in speech power devices using Cadence Tensilica processors.
Toshiba speeds storage controller software development using Palladium Z1 and Protium S1 platforms
Samsung accelerated its ISP IP verification Using the Palladium Z1 Platform with UVM
Discover how Renesas used Cadence tools for faster performance analysis.
Discover how Toshiba is using the Tensilica Vision P6 DSP as an image recognition processor for ADAS applications.
Discover how Socionext used the digital full flow the successful production tapeout of its 16nm ASIC chip
Find out how Cadence helps overcome challenges faced while designing GPUs and SoCs.
Discover how NSITEXE used the digital design full flow for its data flow processor IP
Understanding how brains compute by using Cadence solutions to process artificial heart beats
Cadence Allegro tools used to build largest neuromorphic computer in the world
Next-gen digital hearing aids with increased computation performance created using Cadence Tensilica IP
Cadence Tensilica IP helps integrate sensors for improved safety and increased accessibility
Autoware and Cadence create open source software to optimize development of automotive platforms
Find out from the Nuvia leaders how designing with Cadence helps them reimagine silicon design.
Discover how Uhnder created the world’s first digital radar chip.
