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    • Digital Design and Signoff
      Digital Design and Signoff Overview

      Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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    • Custom IC
      Custom IC / Analog/ RF Design Overview

      Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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    • Verification
      System Design and Verification Overview

      Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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    • IC Package
      IC Package Design and Analysis Overview

      Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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    • System Analysis
      System Analysis Overview

      Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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    • PCB Design
      PCB Design and Analysis Overview

      Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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          Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.

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Conference Proceedings

AI Research and Academic Network
  • Academic 1 : Domain-Specific AI: Practices and Applications
    Xin Li, Duke University
  • Academic 2 : VLSI Mask Optimization: From Shallow To Deep Learning
    Bei Yu, Chinese University of Hong Kong
  • Academic 3 : Formal Verification of Two Cases: RISC-V RV32I and Hardware Trojan-embedded DNN
    Yean-Ru Chen, National Cheng Kung University
  • Academic 4 : Collaboration Between Academia and Industry Using Tensilica DSP IP
    Anton Klotz, Cadence
Custom Analog and Mixed Signal
  • Analog 1 : Collaboration with Cadence for UMC 28HPC+ AMS Reference Flow
    Yueh Guey Chou, UMC
  • Analog 5 : Safe Operation Area Check &Floating Node Check
    Po Sheng Chen, Nuvoton
  • Analog 6 : Leverage AMS in Mixed-Signal Power Management IC Design for Powerful and Effective Flow
    Jesse Wang, ON Semiconductor
  • Analog 7 : Early Detection of Circuit Reliability Issues with Schematic-Level Reliability Verification
    I-Lun Tseng, Zhao Chuan Lee, Vikas Tripathi, Chun Ming Tommy Yip, and Jonathan Ong, GLOBALFOUNDRIES
  • Analog 8 : MathWorks and Cadence Integration: Design and Verification of Mixed-Signal Systems
    Phoebe Li, TeraSoft
Digital Full Flow Design
  • DIF 2 : Using Machine Learning to Improve PPA
    Feng-Yuan Lu, MediaTek
  • DIF 3 : Beyond the Noise: What's the Efficient Methodology to Fix Glitch in N7?
    YIWEI CHEN, MediaTek
  • DIF 4 : IR Closure Flow From Specification to Sign-off
    Ichiro Lin, Faraday
  • DIF 5 : The Challenge and Experience Sharing on 7nm Multi-Billion Gate Design Implementation
    DS Fu, GUC
  • DIF 6 : Best Practices for Arm Cortex-A55 Energy Efficient Implementation Flows in POPTM IP on 22nm
    Herbert Shen, Arm
  • DIF 7 : Early Detection of Cu Pooling Hotspots Using Advanced CMP Modeling
    Single Hsu, UMC
    Ethan Wang, Cadence
IC Design on the Cloud
  • Cloud 2 : EDA on AWS - Accelerating Design Innovation
    Jhen-Wei Huang, AWS
  • Cloud 3 : Microsoft Azure for Silicon Design
    Andy Chan, Microsoft
  • Cloud 4 : The Cadence Cloud Portfolio
    Craig Johnson, Cadence
PCB Design and System Analysis
  • PCB 1 : True 3D Analysis of Large Geometrics with Clarity 3D Solver
    Jian Liu, Cadence
  • PCB 3 : Study on DDR Tabbed-Routing Structure
    John Lin, Lenovo
  • PCB 4 : 30 Years of Digital Transformation
    Yi-Chien Huang, Footprintku
  • PCB 5 : An Efficient PDN / IR Drop / SI Check Verification with Sigrity
    Ming Chen, Chunghwa Precision Test
  • PCB 7 : Correlation of E-T Co-Sim with IR Camera Measurement on Multi-Board System Design
    Hank Lin, ASUS
System Design and Verification
  • Verification 1 : Optimizing Verification Throughput for a Connected World
    Michael Young, Cadence
  • Verification 2 : Streamline the Verification Flow and Apply to DisplayPort 8K4K Design
    Philip (Ming-Fu) Tsai, GUC
  • Verification 5 : Using JasperGold to Verify Full Function of Design From Input to Output
    Pham Van Khich, Renesas
  • Verification 6 : JasperGold FPV for Post-Silicon Debug
    Hugh Lo, Realtek

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