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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows
  • Voltus IC Power Integrity Solution

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
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  • Static and Formal Verification
  • Planning and Management
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  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Denali Memory Interface and Storage IP
  • 112G/56G SerDes
  • PCIe and CXL
  • Tensilica Processor IP
  • Chiplet and D2D
  • Interface IP

RESOURCES

  • Discover PCIe

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • Flows
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools

Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / Machine Learning

AI IP Portfolio

Industries

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  • Automotive
  • Hyperscale Computing

Technologies

  • 3D-IC Design
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  • Arm-Based Solutions
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
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Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
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KR - Korea
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Taiwan - 繁體中文
  • 제품소개
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • Flows
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • 솔루션
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • 기술지원 및 교육
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
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Channel Partners
Program

Building relationships you can trust

Become a Channel Partner

Cadence understands the complex IC, package, and PCB design challenges you face in today’s competitive market. We partner with leading companies around the world to help you stay ahead of your competitors. Find the right sales, support, and service organization from our worldwide network of channel partners.

  • PCB & Analysis

  • CFD

SPAIN
SYJ, Co.
C/ Gonzalo de Berceo 16 Cabanillas del Campo PO. Box: 19171 Contact person: Remi Lestriez
Website: www.numiberica.com

JAPAN

VINAS Co., Ltd.

POC: Fujikawa Yasuhiko

Keihan Dojima Bldg 2-1-31 Dojima,

Kita-Ku, Osaka

PO. Box: 530-0003

Website: www.vinas.com

NEW ZEALAND
Precursor Development Ltd
Level 1, 13 Edsel Street, Henderson, Waitakere, Auckland PO. Box: 605 Contact Person: Matthew Hall-Smith
Website: www.precursor.co.nz

GERMANY

Numeca Ingenieur Buro

POC: Thomas Hildebrandt

Türkeistraße 11,

Altdorf b. Nürnberg

PO. Box: D-90518

Website: www.numeca.de

ITALY
NSI
Via Lavoria 27, Crespina (Pi) PO. Box: 56040 Contact person: Francesco Peracchini
Website: www.numerical.it

NETHERLANDS

CelSian Glass & Solar B.V.

POC: Harmen Kielstra

Achtseweg Zuid 241-A,

Building TZ, Eindhoven

PO. Box: 5651

Website: www.celsian.nl

GERMANY

Tecplot Europe

Genias Graphics GmbH and Co. KG,

Gutenbergstr. 19, 2. OG,

Regenstauf

PO. Box: 93128

Website: www.tecplot.com

KOREA

NinePlus

#1502, 84,

Gasan digital 1-ro,

Geumcheon-gu, Seoul

Phone: 82.2.6123.3355

Fax: 82.2.6123.3350

PO. Box: 8590

Website: www.npit.co.kr

SWEDEN
neptech AB
Sickla All‚ 41, Nacka PO. Box: 13165 Contact person: Faranggis Bagheri
Website: www.neptech.se
UNITED STATES
Concepts NREC
217 Billings Farm Rd, White River Junction, Vermont PO. Box: 05001-9486 Contact person: Peter Weitzman
Website: www.conceptsnrec.com

ISRAEL

Israeli CFD Center

POC: Yuval Levy

9 Halamish Street,

Ofek 4 Building,

Caesarea Industrial Park

P.O. Box 3174

Website: www.iscfdc.com

UNITED KINGDOM
AC&E Ltd
The Innovation Centre, SciTech Daresbury, Keckwick Lane, Cheshire PO. Box: WA4 4FS Contact person: Anthony Mosquera
Website: www.acel.co.uk
UNITED KINGDOM
CFD Technologies
35 Dobcroft Road Millhouses, Sheffield PO. Box: S7 2LQ Contact person: John Stone
Website: www.cfd-technologies.co.uk

ISRAEL

CADCAM Ltd

POC: Arie Braverman

67 Hayarkon St.,

Bnei Brak

PO. Box: 5120613

Website: www.cadcam.co.il

Email: info@nordcad.dk

DENMARK

Nordcad Systems A/S

Ryesgade 60b, st. th DK-9000

Aalborg

Website: www.nordcad.dk

GERMANY

CFD Beratung

POC: Ulrich Fuchs

Bodelschwinghweg 4,

Rottenburg

PO. Box: 72108

Website: www.cfd-beratung.de

SOUTH KOREA

SYJ, Co.

POC: Youngjin Seo

6th Fl., 69,

Gyeryong-ro 553 beonan-gil,

Seo-gu, Daejeon

PO. Box: 35263

Website: www.syj2.kr

INDIA

KFour Metrics

POC: Shaila and Venkatesh Chavaly

8-2-677/B/3,

‘Avanti’ Road No: 12, 

Hyderabad, Telangana  

PO. Box: 500034

Website: www.kfourmetrics.com

FINLAND

CFD-Finland Oy

POC: Huachen Pan

Auringonkatu 8 F,

Espoo

PO. Box: 2210

Website: www.cfd-finland.fi

AUSTRALIA

Applied CCM

POC: Darrin Stephens

Factory 14,

756 Burwood Highway,

Ferntree Gully,

PO. Box: 3156

Website: www.appliedccm.com.au

CANADA

Applied CCM, Inc.

2125 Dutton Cr.

Ottawa

PO. Box: K1J6K3

Website: www.appliedccm.ca

CHINA

Shanghai Feiyi Software Technology Ltd

POC: Jinglong Fan

Room 609B, No 333,

Hongqiao Rd Xu Jiahu,

Shanghai

PO. Box: 200030

Website: www.shanghaifeiyi.cn

TURKEY
PARS MAKINA SAN. VE TIC. LTD STI
OSB Mahallesi, Turan, Çiğdem 30, Ankara PO. Box: 6374 Contact person: Ibrahim Sinan Akmandor
Website: www.parsmakina.com/en/

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