3D電磁界解析

Cadence® AWR® Analyst™ 3D有限要素法(FEM)電磁界(EM)解析および分析シミュレータが、初期の物理設計の特性評価から完全な3DEM検証まで、高周波製品の開発を加速します。高度なソルバ技術は、今日の複雑な高周波電子機器に見られる3D構造/相互接続の高速かつ正確な分析を提供します。

Key Benefits

Integrated

In-situ analysis enables full characterization of 3D components in RF/microwave devices to ensure design success

Flexible

Parametric cell (PCell) support for 3D structures enables an FEM-based design flow that incorporates accurate, custom component libraries

Accurate

Automatic, adaptive 3D volumetric tetrahedron-based meshing provides high-quality shape fidelity to ensure reliable simulation results

Features at a Glance

  • 抽出 – 回路図駆動型のEM抽出 技術/設計フロー

  • レイアウト/描画エディタ – 2Dおよび3Dの構築と表示

  • FEMソルバ – 独自のフルウェイブダイレクトおよびイタレイティブ ソルバ

  • メッシュ技術 – 自動で適応性のある3Dの四面体を利用したメッシュ

  • ソース – ポートの多数の励起

  • 表示– 2Dおよび3のフィールド表示と結果の後処理

  • パラメトリックスタディ – 最適化、チューニングおよび歩留まり解析

  • 高性能 計算(HPC) – マルチコア構成 および非同期解析 

Applications

Passives

Characterize and optimize the electrical performance of RF/microwave distributed components such as spiral inductors and metal-insulator-metal (MIM) capacitors with 3DEM analysis.

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MMIC/RFIC, PCB, Packaging, and Module Interconnects

Model the behavior of complex interconnects such as vias, via fencing, wire bonds, and ball-grid arrays with fast and accurate FEM full-wave simulation technology.

Antennas and Arrays

Simulate near- and far-field radiation patterns, surface currents, gain, bandwidth, and return loss for planar, 3D, and phased array antennas.

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Verification

Analyze entire PCB and MMIC/RFIC layouts as part of design verification and final signoff, capturing unintended resonances and parasitic coupling that can lead to costly design failures.

Resources

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