Overview
Intelligent Unparalleled Performance
Cadence Protocol IP for AI, including PCI Express® (PCIe®), UALink, CXL, Universal Chiplet Interconnect Express (UCIe™), and advanced memory interfaces such as HBM and GDDR, is engineered to optimize AI applications across markets. These technologies provide high-performance, low-latency interconnects for efficient data transfer and seamless communication, supporting various data speeds and configurations. Our AI systems handle intensive computational tasks and large datasets with enhanced performance, power efficiency, and scalability.
Key Benefits
Transforming AI with Speed, Scalability, and Efficiency
High Performance
Optimized for high-speed data processing, ensuring that AI applications run smoothly and efficiently
Scalable
Designed to support a wide range of AI applications, our IP can scale to meet the demands of both small and large projects
Low Power
Engineered to be energy-efficient by reducing power consumption without compromising performance
Reduced Latency
Experience real-time processing and decision-making with minimal latency, crucial for time-sensitive AI applications
Offerings
Protocols Powering Advanced AI Performance
PCIe and CXL for AI
Cadence's PCIe and CXL products for AI deliver robust, high-speed interconnect solutions that facilitate efficient data transfer and communications. Our cutting-edge PCIe and CXL products support a wide range of configurations with processing nodes. By leveraging PCIe and CXL, AI developers can achieve faster data processing, reduced latency, and improved system reliability in their AI applications.
High-Speed SerDes for AI
Cadence's High-Speed SerDes products for AI enable ultra-fast data transfer and communication. These solutions support high data rates and maintain long-reach performance, ensuring efficient connectivity for AI applications. With industry-leading power efficiency and compatibility across various process nodes, our SerDes products help AI developers achieve superior system performance and reliability
UCIe PHY and Controller for AI
Cadence's UCIe products advance AI capabilities by delivering high-performance, low-latency interconnect solutions for chiplets within a package. These products enable seamless communication between chiplets and support a variety of data speeds and channel lengths. Available across multiple process nodes and configurations, they allow compatibility with various manufacturing technologies. Using UCIe, AI developers can now achieve higher performance, improved power efficiency, and greater scalability in their AI systems.