SI/PI Analysis Point Tools for IC Packaging

Cadence^® power integrity (PI) solutions, based on Sigrity^™ technology, provide signoff-level accuracy for AC and DC power analysis of PCBs and IC packages. Each tool seamlessly interfaces with Cadence Allegro^® PCB and IC packaging physical design solutions.

Cadence power-aware signal integrity (SI) tools, based on Sigrity technology, provide signoff-level accurate SI analysis for PCBs and IC packages. Signoff-level SI accuracy of signals with frequency higher than 1GHz must consider the signals and the power/ground network that enables the current return path. Cadence power-aware SI tools interface seamlessly with Allegro PCB and IC packaging physical design tools to create a complete power-aware design and SI analysis solution.

Cadence package design and assessment tools, based on Sigrity technology, provide IC package design, analysis, and model extraction capability—and can exchange data with Allegro Package Designer Plus and its SiP Layout Option. Assessment capabilities allow you to quickly spot potential signal and power integrity issues. Model extraction capabilities provide unique full package model extraction with accuracy into the multi-GHz frequency range.