overview
A Depth of Knowledge and Experience to Meet the Challenges Automakers Face
The automotive industry is rapidly evolving, and autonomous and electric vehicles are some of the fastest-growing applications in the automotive industry. Today’s vehicles are now moving toward new vehicle architectures to address the compute and in-vehicle networking bandwidth requirements. This will drive complex and consolidated electronic control units (ECUs) running at giga-Hertz frequencies that need to be designed and optimized for scalability, performance, power efficiency, thermal, and EMI robustness.
Key Benefits
Advanced Tools and Flows Specifically for Automotive SoCs, Packages, Boards, and Systems
Highly Automated
Integrated functional safety flows, from FMEDA to safety-aware implementation
Chiplet Solution
Most comprehensive solution for heterogeneous chiplet-based SoC design
Scalable
High-performance multi-core DSP and AI platform for automotive
End-to-End Solutions
Seamless design flows from chip to package to board and systems
ISO 26262 TCL Compliant
Fit for use with ASIL A through ASIL D automotive design projects
Advanced Node
Innovative IC design tools and flows supporting the latest process technologies down to 3nm
Automotive Functional Safety Document Kits
Cadence is the first EDA supplier to earn the "Fit for Purpose - Tool Confidence Level" certification up to TCL3, for ISO standards, supporting automotive design from ASIL A through ASIL D.
Offerings
Helping the Automotive Industry Make Cars Safe, Secure, Reliable, and Efficient
Generative AI
In today’s world, technology is evolving at an unprecedented pace. Artificial intelligence (AI) has emerged as a major driving force behind this evolution. AI is transforming the way we interact with technology, from our smartphones to our vehicles.
Cadence.AI offers unique solutions for automotive chip and system design. Our solutions include AI-powered IC and SoC design, verification, PCB design, and multiphysics analysis. By harnessing the power of AI, we are ushering in a new era of AI IP and chip creation.
System Analysis
The demand for high-performance electronic systems is rising due to their increasing complexity and density. Designers must guarantee that the chip or ECU operates seamlessly within the complete system of the vehicle. To ensure this, an integrated analysis that covers multiple areas such as thermal, radio frequency, electromagnetic, signal integrity, power integrity, and fluid dynamics is essential. This thorough analysis ensures that the system is verified at all levels, ranging from the chip to the board to the ECU.
Computational Fluid Dynamics
The possibilities for optimizing vehicles are almost endless, from external aerodynamics and acoustics to engine efficiency, electrification, and comfort. Cadence CFD tools can be utilized for a variety of purposes to accommodate multiple simulation requirements, at the necessary speed and accuracy levels. They offer quick results, ensuring that project timelines are met while allowing for the exploration of design enhancements.
ECU Design
The automobile has always presented challenges for electronic design and signal accuracy. With the increasing complexity of electronic control systems, higher computing performance, faster data rates, and fewer ECUs per car, modern ECUs face significant design, integration, and verification challenges. Cadence is the only company that provides integrated design tools for IC package and PCB design and analysis, ensuring a cohesive and integrated ECU design and analysis.
SoC Design
The complexity of automotive SoCs and systems is continuously increasing due to AD and chip/system consolidation. It is expected that both monolithic and chiplet-based SoCs will need to utilize the most advanced process technologies that are qualified for automotive purposes. For this reason, Cadence IC, packaging and IP solutions offer complete, integrated, and silicon-proven design flows for custom/analog, digital, and mixed-signal SoCs. This is to ensure that automotive designers meet the demanding standards for quality, reliability, and safety.
Chiplets
The semiconductor industry is undergoing a major transformation from traditional monolithic system-on-chip (SoC) architectures to modular, multi-die, and chiplet-based designs. Cadence IP solutions, EDA tools, advanced packaging technologies, and design services enable the disaggregation of monolithic SoC designs into modular chiplets. This comprehensive suite includes full implementation flows, die-to-die connectivity using UCIe™ standards, protocol IP, reusable verification IP, and multiphysics system analysis to accelerate time to market and reduce costs.
Cadence also offers a chiplet-based physical AI platform as an enabler of customer-designed systems, including chiplets as part of the Arm ecosystem. This platform includes a scalable architecture consisting of a base system chiplet that supports a flexible configuration, a configurable AI accelerator based on the Cadence Neo NPU, support for a CPU chiplet, and the incorporation of an optional domain-specific chiplet. Cadence’s dedicated Customer Silicon Design Services help customers de-risk designs and achieve power, performance, and area goals. Working with Cadence silicon engineering experts, designers can quickly turn concepts into packaged, tested parts, enabling them to realize their chiplet ambitions quicker and with fewer engineering resources.
Resources
Browse Recommended Resources
Training and Support
Need Help?
Training
The Training Learning Maps help you get a comprehensive visual overview of learning opportunities.
Training News - Subscribe
Online Support
The Cadence ASK system fields our entire library of accessible materials for self-study and step-by-step instruction.
Request Support
Technical Forums
Find community on the technical forums to discuss and elaborate on your design ideas.
Find Answers in cadence technical forums