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Cadence announced broad IP collaboration with GLOBALFOUNDRIES (GF) on the 12LP platform and 12LP+ solution encompassing support for advanced memory interfaces including DDR4, DDR5, GDDR6, LPDDR4X and LPDDR...
24 Sep 2020
グローバルファウンドリーズ、ケイデンスとの協業により22FDXプラットフォーム向けMixed-Signal OpenAccess PDKを提供し、高度なミックスドシグナル設計およびmmWave設計を実現
Cadence announced a collaboration with GLOBALFOUNDRIES (GF) that resulted in the availability of a Mixed-Signal OpenAccess process design kit (PDK) that supports GF’s 22FDX platform.
24 Sep 2020
Cadence has multiple electromagnetic (EM) technologies within its product portfolio, some of which came via acquisition and others were created internally. With a wide breadth of EM simulation and analysis...
The Cadence® EMX® Planar 3D Simulator is an electromagnetic simulator for high-frequency, RF, and mixed-signal integrated circuits. It allows designers to accurately and efficiently simulate large RF circu...
With data-centric designs demanding increases in the number of on-chip storage elements, the area occupied by macros and memories has also drastically increased. With the number of rectangular macros going...
22 Sep 2020
Today's defense systems are powered by secure electronics platforms and are more complex than ever. Sophisticated commercial electronics companies have evolved strategies to make sure their devices work co...
17 Sep 2020
Cadence announced that it was named a winner in multiple categories in the 17th Annual International Business Awards®, winning the Gold Stevie® Award for Most Innovative Tech Company of the Year and for In...
17 Sep 2020
There are multiple computer hardware architectures and operating system (OS) versions available for hosting Cadence products … Cadence routinely monitors both vendor offerings and …