04 Apr 2022
New Electromagnetic In-Design Analysis Capabilities Speed IC, IC Packaging and High-Performance PCB Design
SAN JOSE, Calif. (DesignCon)—Cadence Design Systems, Inc. will showcase the latest release of the Cadence® Clarity™ 3D Solver for electromagnetic (EM) in-design analysis of IC, IC packaging and high-performance PCB designs at DesignCon 2022 in booth 927, as well as in multiple customer presentations throughout the conference. Visit our DesignCon web page for more information and to register for the educational sessions.
WHAT: Cadence experts will demonstrate the new capabilities and workflows enabled by the latest release of the Clarity 3D Solver, 2022.1, including:
- New distributed meshing delivering at least 10X performance
- Artificial intelligence and machine learning (AI/ML)-enabled optimization that quickly and efficiently explores design space and produces optimal designs
- Seamless integrated workflows with the Cadence Allegro®/Allegro Package Designer Plus, Integrity™ 3D-IC, Virtuoso® RF and AWR® microwave/RF platforms
"Electromagnetic (EM) analysis for IC packaging and high-performance PCB designs is growing in scope and complexity, particularly for interposer and rigid-flex applications," said Ben Gu, vice president of the Multiphysics System Analysis Business Group at Cadence. "Increasingly, customers are relying on the speed, accuracy and capacity of the Cadence Clarity 3D Solver to complete these challenging designs on schedule."
The advanced meshing technology in the Clarity 3D Solver continues to expand with the addition of new distributed meshing algorithms that now include both layer-based (LMesh) and arbitrary 3D (XMesh) approaches. Both techniques speed the initial mesh process more than 10X, which translates to a significant reduction in simulation run times.
“Design complexity is increasing in 3D-ICs and for advanced ball grid array (BGA) substrate designs, we need a better meshing tool to make sure 3D finite element method (FEM) extraction is efficient,” said Dr. Stephen Chen, Director of High Speed Signal and Thermal Simulation Department at GUC. “Compared with the previous meshing tool in the Clarity 3D Solver, we are seeing that the newly introduced XMesh approach reduces our meshing time significantly in advanced package designs and, in addition, boosts the performance in a complete model extraction process.”
Resource- and time-intensive parametric sweeps are typically used by engineers to optimize both the physical structure and electrical behavior of their designs. With the introduction of new AI/ML techniques, the Clarity 3D Solver significantly improves designer productivity and analysis efficiency in order to zero in on the design.
The Clarity 3D Solver continues to be integrated as the seamless go-to EM in-design analysis solution within Allegro/Allegro Package Designer Plus, Integrity 3D-IC, Virtuoso RF and AWR microwave/RF platforms to enable customers to speed up their concept-through-production workflows.
In addition to the in-booth demonstrations, the following presentations will feature Cadence in-design system analysis workflow solutions within the Cadence sponsored session on Thursday, April 7, 2022 in Mission City Ballroom - B5:
- Amphenol: 112G Connector and Board Design/Analysis Workflow
- Meta (Facebook): MIPI®-C Board and Camera Interface Design/Analysis Workflow
- Microsoft: Interconnect Optimization of Wearables with an In-Design Analysis Workflow
WHEN: DesignCon will take place April 5-7, 2022.
WHERE: Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, Calif. Cadence is in booth 927.
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at www.cadence.com.
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