In this era of More than Moore, the use of 3D-IC technology is gaining popularity with the promise of delivering higher performance electronic designs. However, going to 3D introduces major challenges in both thermal and power integrity management. Addressing these challenges requires a full 3D-IC holistic approach rather than analyzing each chiplet separately. In addition, it’s important to evaluate the implications of multiple 3D-IC topologies—such as CoWoS, InFO, SoIC, F2F, EMIB, etc. This requires fast prototyping and analysis to understand cost and performance tradeoffs for the different 3D-IC architectures. The Cadence Celsius and Voltus thermal analysis solution overcomes thermal and power challenges, enabling customers at the leading edge to tape out their designs.