Become Cadence-certified in the system-level signal and power integrity design domain by taking a curated series of our online courses and passing the badge exams for each class.
First, you will utilize Sigrity Aurora to develop design rules for high-speed designs and leverage the benefits of performing pre-layout analysis with preliminary analysis on a design.
You will then refine your understanding of power integrity design by incorporating thermal effects into your design with the Celsius Thermal Solver course. This course will also review CFD simulations necessary for viewing the thermal effects when using a fan and a chassis to cool a system and how that affects the voltage margins on a design.
Next, you will use Sigrity SystemSI to perform parallel bus and serial link analysis using a block-level modeling approach. The block-level approach is useful for both pre-route and post-route simulations.
You will then dive deeper into signal integrity by using the Clarity 3D Solver tool to model and simulate designs in 3D, providing higher accuracy for critical design structures.
Lastly, you will extract S-parameters of a design using PowerSI for various topologies, including a parallel bus and a serial link. This course will also guide you in creating several SPICE models for various components and interfaces with the Broadband SPICE tool.
Learning Objectives
After completing this course, you will be able to:
Create, extract and explore topologies
Run solution space analysis
Create an electrical constraint set
Apply constraints to drive placement and routing
Analyze nets on the routed board design for signal integrity
Use the Workflow manager to analyze impedance, crosstalk and IR Drop on a PCB
Set up a board database for analysis
Perform static IR Drop analysis on a routed board
Perform an electrical and thermal co-simulation
Graph the impedance of the power distribution network across a complete frequency bandwidth
Assign capacitor models to an existing printed circuit board
Create and edit capacitor models
Optimize capacitor selection for performance and cost
Import PCB and IC packaging data in Celsius Thermal Solver
Create boundary conditions and set up VRMs and sink components for an electrical and thermal co-simulation
Run a static E/T co-simulation and view the resulting tables and graphs
Run a transient E/T co-simulation and view the resulting tables and graphs
Build a 3D heatsink
Import and export components for projects
Set parameters and run sweep simulations
Import PCB and IC package layered structures
Run a CFD flow for thermal analysis of a PCB with a chassis and fans
Build block-level topologies of pre- and post-routed parallel bus systems and serial link systems
Generate a W-Element transmission line model to represent the pre-routed parallel bus or serial link interfaces
Assign electrical models to the blocks of parallel bus or serial link systems
Connect blocks of the systems using the model connection protocol
Set up analysis options for circuit/channel simulations
Set voltage and current probe points
Sweep key design parameters defined in the electrical models of interconnects and various components
Run simulations of pre-routed and post-routed power aware parallel bus systems
Run simulations of serial link systems with AMI and IBIS models
View simulation-generated plots and graphs
Generate simulation-based reports
Analyze simulation-based results to evaluate the power and signal integrity performance of the design
Explore the effects of cross talk on a serial-link channel
Apply a systematic process to resolve issues that may arise when using the SystemSI tool
Import PCB and interposer models into Clarity 3D Layout
Specify a cut-out region for a PCB
Generate ports for simulation
Set up the simulator by controlling frequency settings, solver settings and geometry options
Run 3D electromagnetic simulations
View and plot the waveform, mesh and field results
Import 3D STEP models into Clarity 3D Workbench
Create components in Clarity 3D Workbench
Merge 3D models with a PCB
Run 3D electromagnetic simulations of the merged 3D model and PCB
Automate portions of the design process with Tcl
Generate electrical models (S-parameters and SPICE equivalent circuits) of pre- and post-routed high-speed interfaces on PCBs and IC packages
Perform detailed frequency domain analysis for evaluating the power and signal integrity performance of those interfaces
Software Used in This Course
This certification program contains several courses, each with its own software requirements. Refer to each of the course links provided in the course description and course contents for the specifics.
Software Release(s)
Each course URL contains the software release information for that course.
