DC and Thermal Analysis with Celsius PowerDC Training

Length: 2 Days (16 hours)

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Course Description

In this course, you will use the Celsius PowerDC software to perform a static IR Drop analysis on a power delivery system. You will set constraints in the simulation and learn how to verify these constraints. After the IR Drop analysis, you will use the Celsius PowerDC software to perform an electrical-thermal co-simulation, which models the converged solution for a design that considers the rising resistances due to increased temperatures and the increase in temperature due to increasing electrical resistances.

Next, you will use the Celsius CFD engine to model the effects of a chassis, fans, and an opening, as well as the effects they have on the original design.

Lastly, you will create 3D structures in the Celsius environment, sweep the structures to capture optimal performance, and view the various thermal and electrical performances of the various 3D designs, including those with static inputs and transient inputs. 

Learning Objectives

After completing this course, you will be able to:

• Simulate the IR Drop of a design
• Simulate the Electrical-Thermal co-simulation of a design
• Capture the effects of a fan, chassis, and opening with the CFD Fluid Flow workflow
• Create a 3D design for Electrical-Thermal co-simulation
• Sweep parameters
• Simulate a static thermal simulation
• Simulate a transient thermal simulation

Software Used in This Course

• Celsius PowerDC (Celsius Advanced PTI)
• Celsius Layout (Celsius Advanced PTI)
• Celsius Fluid Flow (Celsius Advanced PTI)
• Celsius 3D Workbench (Celsius Advanced PTI)

Software Release(s)

SYSANLS20240

Modules in this Course

• Introduction to Celsius PowerDC
• Static IR Drop Analysis
• Celsius PowerDC Constraints
• Celsius PowerDC Sweep Analysis
• Single-Board Electrical/Thermal Co-Simulation
• Single-Board E/T Co-Simulation CFD Workflow
• Solid Object Static Simulation for 3D Structures
• Solid Object Transient Simulation for 3D Structures
• Building a 3D Heat Sink
• Sweeping Parameters

Audience

• Power Integrity Engineers
• Signal Integrity Engineers
• Thermal Design Engineers
• Hardware Design Engineers

Prerequisites

You must have experience with or knowledge of the following:

• Basic understanding of board layout and high-speed design
• Familiarity with basic PCB and IC packaging concepts
• Basic knowledge of 3D electromagnetic simulation

Related Courses

• Sigrity Aurora
• Celsius Thermal Solver
• Sigrity PowerDC and OptimizePI