TopXplorer SystemSI for Parallel Bus and Serial Link Analysis

Length : 2 days

Course Description

Learning Objectives

• Build block-level topologies of pre and post-routed parallel-bus systems (PBSs) and serial link systems (SLSs) in the TopXplorer-SystemSI Parallel Bus Analysis II and Serial Link - Analysis II tools.
• Generate a W-Element transmission line model to represent the pre-routed parallel bus or serial link interfaces.
• Assign electrical models to the blocks of PBSs and SLSs.
• Connect blocks of PBSs and SLSs, using the model connection protocol (MCP).
• Setup analysis options for circuit/channel simulations of PBSs and channel simulation of SLSs.
• Set voltage and current probe points in PBSs and SLSs.
• Setup sweeping key design parameters defined in the electrical models of interconnects (PCBs and Packages), controller, receiver, transmitter and receiver etc.
• Run simulations or sweep-mode simulations of pre-routed parallel bus systems and post-routed power-aware parallel bus systems.
• Run simulations or sweep-mode simulations of serial link systems, using AMI and IBIS-AMI models for the transmitter and receiver components.
• View simulation generated 2D plots, eye diagrams, BER eye, bathtub, impulse response, ramp response etc.
• Generate simulation-based reports with tables and waveforms.
• Analyze simulation-based results, waveforms and tables to evaluate the power and signal integrity performance of the PBSs and SLSs.
• Use a built-in template with the serial-link system topology consisting of three coupled serial-link channels for simulation-based analysis to explore effects of crosstalk on the primary serial-link channel.
• Apply systematic process, in terms of strategies and solution, to resolve issues, which may arise in using the TopXplorer-SystemSI tools.

Software Used in This Course

Software Release(s)

OrCAD/Allegro 17.4 (SPB174); SIGRITY2019

Modules in this Course

Audience

Prerequisites

You must have a basic understanding of:

Power and signal integrity issues in the high-speed parallel bus and serial link systemsTransmission lines, S-parameters and electrical modeling of PCB and IC packagesPrinted circuit board layouts, such as layers, planes, stackup, vias, dielectric constants, conductivity, etc.

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