Allegro Package Designer Plus

Length : 3 days

Course Description

In this course, you learn the complete flow of a package design, from defining the module outline to placing components, defining a netlist, placement, routing, documentation, and manufacturing output. You will create a BGA package containing a flip-chip and wire-bonded stacked die together with discrete components.

Learning Objectives

After completing this course, you will be able to:

• Develop a process flow to suit your design needs
• Create a cross section and design constraints
• Wire bond a stacked die design
• Use the 3D Canvas to view your design in three dimensions
• Route the design using interactive and automatic methods
• Generate a variety of manufacturing outputs

Software Used in This Course

• Allegro Package Designer Plus

Software Release(s)

SPB174

Modules in this Course

• Introducing Allegro Package designer Plus
• Creating a New Package Design
• Modifying Components and Netlist
• Setting Design Rules
• Wire Bonding
• 3D Viewing
• Embedded Components
• Routing and High-Density Interconnect
• Design Verification and Manufacturing Output

Audience

• IC package designers

Prerequisites

Before taking this course, you should have a working knowledge of:

• IC package design and construction

Related Courses

Please see course learning maps at this link for a visual representation of courses and course relationships. Regional course catalogs may be viewed here.