Length : 3 days
Course Description
In this course, you learn the complete flow of a package design, from defining the module outline to placing components, defining a netlist, placement, routing, documentation, and manufacturing output. You will create a BGA package containing a flip-chip and wire-bonded stacked die together with discrete components.
Learning Objectives
After completing this course, you will be able to:
- Develop a process flow to suit your design needs
- Create a cross section and design constraints
- Wire bond a stacked die design
- Use the 3D Canvas to view your design in three dimensions
- Route the design using interactive and automatic methods
- Generate a variety of manufacturing outputs
Software Used in This Course
- Allegro Package Designer Plus
Software Release(s)
SPB174
Modules in this Course
- Introducing Allegro Package designer Plus
- Creating a New Package Design
- Modifying Components and Netlist
- Setting Design Rules
- Wire Bonding
- 3D Viewing
- Embedded Components
- Routing and High-Density Interconnect
- Design Verification and Manufacturing Output
Audience
Prerequisites
Before taking this course, you should have a working knowledge of:
- IC package design and construction
Related Courses
Please see course learning maps at this link for a visual representation of courses and course relationships. Regional course catalogs may be viewed here.
