Model Generation and Analysis using PowerSI and Broadband SPICE

Length: 3 days (24 Hours)

Digital Badge Available

Course Description

This course first presents model generation and analysis of a simple PCB using PowerSI. Building a simple pre-layout PCB in PowerSI followed by studying electrical parameters of signal traces reported in the Trace Properties window and comparing those electrical parameters with the electrical parameters computed using the closed form expressions are discussed in this module. Next, the process of generating S-parameters for power and signal nets of the simple pre-layout PCB, computing impedances and loop inductances of power and signal nets are discussed in this module. 

Next, this course presents model generation and analysis of a parallel bus and then a serial link system using PowerSI and Broadband SPICE tools. The methodology of generating S-parameters, first for the power-aware parallel bus interface and, next, the serial link interface of a post-layout real-world PCB is discussed in detail in this module. The process of analyzing S-parameters for the parallel bus and serial link interfaces in terms of return loss, insertion loss, open-circuit and short-circuit impedance parameters is discussed in this module. Also, the process of generating SPICE equivalent circuit model for the power-aware parallel bus interface of the PCB, using the Broadband SPICE tool, is illustrated in this module.  

Finally, this course presents model generation and analysis of an IC package, using PowerSI and Broadband SPICE tools. The methodology of generating S-parameters for signal and power nets of a power-aware parallel bus interface and core-power delivery network of a flip-chip IC package is discussed in this module. The process of generating RLGC parameters from the PowerSI generated S-parameters is discussed in this module. Finally, the process of generating SPICE equivalent circuit model for the power-aware parallel bus interface and the core-power delivery network of the flip-chip IC-package, using the Broadband SPICE tool, is illustrated in this module.  

Learning Objectives

After completing this course, you will be able to:

• Use PowerSI and Broadband SPICE tools to generate electrical models (S-parameters and broadband SPICE equivalent circuit) of pre- and post-routed high-speed interfaces on PCBs and IC packages and perform detailed frequency-domain analysis for evaluating power and signal integrity performance of these interfaces.

Software Used in This Course

• Sigrity PowerSI 2021.1
• Sigrity Broadband SPICE 2021.1

Software Release(s)

SIGRITY2021.1

Modules in this Course

• Model Generation and Analysis of a Simple PCB using PowerSI
• Model Generation and Analysis of a Parallel Bus and Serial Link Systems Using PowerSI and Broadband SPICE
• Model Generation and Analysis of an IC Package Using PowerSI and Broadband SPICE 

Audience

• Engineers involved in electrical model generation and frequency-domain power and signal integrity perfromance evaluation based on the development of high-speed PCB and IC package systems.

Prerequisites

You must have experience with or knowledge of the following:

• PCBs, IC packages, transmission lines, S-parameters, SPICE equivalent circuit models, and 
• Practical understanding of power and signal integrity issues in high-speed interfaces of PCBs and IC packages

Related Courses

• Sigrity SystemSI for Parallel Bus and Serial Link Analysis
• TopXplorer SystemSI for Parallel Bus and Serial Link Analysis

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