Length: 2 days (16 Hours)
(Course only available in EMEA)
Course Descriptions
This course is part 2 of a training series on “Understanding High Frequency PCB Design - High-Speed, RF, and EMI
Part 2: PCB Design at RF - multi Gigabit Transmission, EMI Control, and PCB Materials (2 days)
Part 2 extends the principles established in Part 1 to frequencies above 1 GHz for Gb/s serial transmission, and to control EMI at the PCB level.
Key topics cover signal quality, (BER, eye diagrams, ISI, jitter), Gb/s technologies, lossy lines, electrical performance of PCB materials, and EMC from components to backplanes.
Note: The concepts developed in Part 1 are applied to the topics in part 2. Delegates to Part 2 are therefore strongly advised to attend Part 1 first.
Course Content
Part 2:
- High frequency measurement and test. Components and signal paths. Measurements in the time domain (scope, TDR/TDT) and frequency domain (VNA, spectrum analyzer). Probe bandwidth. S-parameters.
- Gb/s transmission on PCBs. Transmission engineering. PCB track effects on signal quality parameters (BER, ISI, jitter) and their measurement. Technologies (e.g LVDS, PCI Express, USB-3, DDR-3). PCB requirements to meet system performance.
- Frequency-dependent PCB transmission lines. Conductor and dielectric loss. PCB materials – frequency behaviour, manufacturing and cost tradeoffs, criteria for acceptable signal performance.
- EMC control. EMI mechanisms – what factors can we control? Wave propagation, near and far field impedance. RF field generation on a PCB. Differential to common mode conversion and radiation.
- Controlling EMI generation on PCBs. Image planes, stackup, return currents. Grounding schemes, common impedance coupling, ground noise voltage, partitioning, split planes.
- EMI from components to systems. IC package parasitics, ground bounce, component level effects. Filtering, isolation and bridging on PCBs. Interconnections, cables, backplanes, signal routing.
Audience
- Design engineers seeking in-depth knowledge of high-speed PCB design, signal integrity issues, and EMC. As the course is built up from basic electrical principles it is suitable for engineers with varied experience, and also for new graduates.
- PCB designers working on digital or mixed signal boards with design rules governing track impedance control, line terminations, routing to minimise noise coupling etc.
Prerequisites
- Knowledge of basic electrical principles
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