Essential High-Speed PCB Design for Signal Integrity

Course Content

Part 1:

• High-speed design overview. What is high-speed? Signal integrity issues for design and layout.
• Signal waveforms, frequency and rise time. Signal bandwidth. How capacitance and loop inductance determine signal quality. Current paths on a PCB.
• Impedance control of the power distribution system. Controlling noise - decoupling networks, PCB planes, bandwidth requirements. Optimizing power delivery.
• Track impedance, reflections and terminations. Practical PCB limits. Input impedance, signal propagation and reflection. Impedance control and termination strategies.
• Differential transmission. Differential and common mode currents, routing and termination.
• Crosstalk. Near end and far end crosstalk, effects of coupled length, track geometry, multiple tracks.
• ICs for high-speed design. I/O characteristics, I/V curves, transition timing. Behavioral device models, IBIS standards.
• PCB routing topologies. Constraints. Discontinuities: connectors, vias, stubs, branching. Equalization, loading, clock distribution.
• PCB structure. Layer stacking principles, fabrication process variables, PCB material effects, impedance measurement.

Audience

• Design engineers seeking in-depth knowledge of high-speed PCB design, signal integrity issues, and EMC. As the course is built up from basic electrical principles it is suitable for engineers with varied experience, and also for new graduates.

• PCB designers working on digital or mixed signal boards with design rules governing track impedance control, line terminations, routing to minimise noise coupling etc.

Prerequisites

• Knowledge of basic electrical principles

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