Allegro Sigrity Package Assessment and Model Extraction Training

Length: 1 Day (8 hours)

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Course Description

The Allegro^® Sigrity^™ Package Assessment and Model Extraction course covers the extraction of both a SPICE model and an IBIS model for a package, as well as the assessment of the power and ground distribution system and the signal distribution of the package. You start by translating a package design into the XtractIM^™ environment and then identify the coupled lines in the package. You extract two types of SPICE models and two types of IBIS models for the package. You use the package assessment features in XtractIM to plot the broadband impedance of the package distribution system and then examine the RLC distributions for each pin of the package. Finally, you plot the insertion loss and the return loss for the nets in the package design.

Learning Objectives

After completing this course, you will be able to:

• Translate a package design into the XtractIM environment
• Identify coupled lines in a package
• Extract a SPICE T-model for a package
• Extract a SPICE Pi-model for a package
• Extract an IBIS package and device model for a package
• Examine RLC distributions in a package
• Plot broadband impedance of the power distribution system
• Plot insertion loss and return loss for the package

Software Used in This Course

• Allegro Sigrity Package Assessment and Extraction
• Allegro Package Designer 

Software Release(s)

SIGRITY2024.0, SPB23.1

Modules in this Course

• Introduction to XtractIM
• Running the XtractIM Extraction
• IC Package Assessment in XtractIM

Audience

• Electrical Engineers
• PCB and IC Package Designers

Prerequisites

You must have experience with or knowledge of the following:

• Signal Integrity Issues
• IC Packaging

Related Courses

• Allegro X Advanced Package Designer Training

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