Length : 4 days
Course Description
In this course, you use the Allegro® Package Designer system for the design and specification of manufacturing single-chip modules for single-, double-, or multilayered analog and digital packages. You develop a process flow, create cross section and design constraints, construct single-chip module connectivity, and route a design. You also create bond pads, make blind and buried padstacks, and output manufacturing data.
Learning Objectives
After completing this course, you will be able to:
- Develop a process flow to suit your design needs
- Create a new BGA package design and define the BGA pads and substrate cross section
- Add a standard die to the package design
- Define netlist connectivity for package and die pins
- Use the Constraint Manager to define physical, spacing, and electrical constraints
- Generate power rings and bond fingers, wire bond the design, and use the 3D viewer
- Define blind and buried vias, route signals interactively and automatically, and add voltage planes
- Output manufacturing data in Gerber or GDSII format, as well as create manufacturing documentation
- Create a new flip-chip package design
Software Used in This Course
- Allegro Package Designer L
- Cadence 3D Design Viewer
- Advanced Package Router Option
Software Release(s)
SPB172
Modules in this Course
- Introducing the Allegro Package Designer
- Starting a New Package Design
- Modifying the Netlist and Components
- Setting Design Rules
- Wire Bonding
- Routing
- Generating Manufacturing Output
- Creating a Flip-Chip Design
Audience
Prerequisites
You must have some experience with or knowledge of the following:
- Single or multichip design and construction
Related Courses
Please see course learning maps at this link for a visual representation of courses and course relationships. Regional course catalogs may be viewed here
