System Analysis
Celsius Thermal Solver
Electrical-Thermal (ET) Co-Simulation for System Analysis
Celsius Thermal Solver for Thermal Management
Utilize electrical-thermal co-simulation to maximize efficiency, tolerance, and the power of the products you’re putting your all into.
overview
A Complete Electrical-Thermal Co-Simulation Technology for IC Packages, PCBs, and Systems
The Cadence® Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture that delivers up to 10X faster performance than legacy solutions without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and PCB implementation platforms.
Key Benefits
Thermal Analysis Delivering Speed, Accuracy, Capacity, and Streamlined Workflows
The Celsius Thermal Solver offers complete electrical-thermal co-simulation for the full hierarchy of electronic systems from ICs to physical enclosures and provides analysis and design insights that empower electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.
Integration
Keep the System Center in Design and Analysis
With greater attention to power and power efficiency comes an immense demand for thermal reliability and simulation of all aspects of system design. Being able to work in a single environment, share data, and enable automation between workflows and user interfaces revitalizes your IC to PCB design workflows.
The Celsius Thermal Solver is integrated with Cadence chip, package, and PCB design platforms, including Allegro® PCB Designer, AWR Design Environment® , the Innovus™ Implementation System, the Virtuoso® System Design Platform, and the Voltus™ IC Power Integrity Solution.
Performance
Bring Massively Paralleled Processing Technology to Your Simulations
Performance
Bring Massively-Paralleled Processing Technology to Your Simulations
Address thermal heating challenges in chips, packages, and systems with complete electrothermal co-simulation for the full hierarchy of electronic systems from ICs to physical enclosures and end-to-end capabilities for in-design through to signoff.
The parallel processing technology within the Celsius Thermal Solver shortens simulation time significantly. Multi-threading and distributed processing are supported, enabling 10X faster simulation times than other solvers. The massively parallelized matrix solver can analyze 3D-ICs and complex 3D structures.
Capacity
Harness Powerful and Hybrid Solver Technology
Innovative multiphysics technology addresses the challenge of multiple power profiles and increased heat dissipation by combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids, enabling complete system analysis in a single tool. The combination of FEA and CFD field solvers provides detailed analysis of the entire system, as well as detailed thermal model analysis of chip, package, and board designs.
Using the Celsius Thermal Solver, designers can import and analyze large package and PCB designs in full detail with no input simplification. Designers can also perform joule-heating, stress, and warpage analysis.
Products
Available from Cadence
Celsius Thermal Solver
The Celsius Thermal Solver is capable of profound temperature accuracy simulations, heat transfer solutions, and electrical-thermal co-simulation. Utilize its suite of CFD and FEA solutions for thermal management today.
Celsius PTI
Celsius Advanced PTI allows power terminal integrity (PTI) experts to perform PDN verification from each power source to each sink across multiple boards and packages.
Celsius PowerDC
To ensure you achieve reliable power delivery, Celsius PowerDC™ technology provides efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation to maximize accuracy.
Highlights
Fast, Reliable Thermal Analysis for PCBs, 3D-ICs, Systems, and Beyond
The Celsius Thermal Solver helps designers avoid costly implementations, engineering delays, product iterations, and field failures. Designers can minimize minimize late-stage design iterations with the mechanical engineering team by performing thermal simulations early in the design phase.
Multiphysics Technology and Field Solvers
The combined FEA and CFD solvers provide detailed analysis of the entire system. The Celsius Thermal Solver also offers advanced finite-element method (FEM) meshing technology, which makes meshing any complex system fast and easy.
Transient and Steady State Analysis
Transient as well as steady-state analysis enables accurate electrical-thermal co-simulation to analyze both transient and steady-state and heat conduction in complicated solid structures.
Massively Parallelized Execution
Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy when analyzing 3D-ICs and complex 3D structures.
Electrical Thermal Reliability
Seamless, simple, and easy integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations.
Temperature Data
RF engineers have ready access to operating temperature data for reliability and performance studies.
Thermal Stress and Strain
Accurate simulation of thermal-induced stress and strain in solid, allows designers to pinpoint problem areas and avoid costly product reliability issues.
Applications
Overcome Your Most Complex Thermal Challenges
SoCs
Floorplan optimization, performance analysis using voltage/frequency corners under thermal constraints, and accurate temperature sensor location.
MMICs
Solutions for RF power amplifier (PA) and monolithic microwave IC (MMIC) designs and RF PCBs and modules that support electrothermal analysis through model information sourced from circuit design software, including existing MMIC design data and geometries such as layout, material properties, and power-source values from RF simulation.
IC Packaging
Transient electrothermal co-simulations to accurately identify temperature and current density issues in packages.
PCB/Modules
Electrothermal co-simulation for full PCB design without any simplification and calculation of IR drop by calculating on the joule heating.
Systems
Develop a thermal management system and identify hot spots and thermal stress-related issues that are among the leading field failure risks in electronic systems.
Related Technologies
More Analysis Needed? No Problem
It’s time to turn those days spent meshing into hours and achieve same-day results for the simulations you need for progress.
Clarity
Utilize the unbeatable simulation speed of Clarity’s finite element analysis (FEA) and finite difference time-domain (FDTD) electromagnetic (EM) field solver.
Sigrity
Ensure any board, package, or system performs well with leading power integrity and signal integrity solutions.
Getting Started
Start Using Analysis Tools Today
Cadence OnCloud Platform for the Multiphysics Analyst
Plan and pricing
Robust multiphysics computational software for electromagnetics, thermal, power, and signal integrity.
- Customizable simulation job speed for increased productivity
- Access cloud-based file storage for input across project team
- Solve with virtually unlimited computational potential
200 hours. Named user license.
Powered By
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Celsius
Absolute temperature accuracy and thermal management analysis across board and 3DIC design.
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Clarity
Adopt unmatched speed in electromagnetic simulation without sacrificing accuracy.
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Sigrity
Robust signal and power integrity with directly integrated results into design optimization suggestions.
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