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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
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      • Custom IC / Analog / RF Design
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          • Spectre X Simulator
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          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
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          • Static and Formal Verification
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        • FEATURED PRODUCTS
          • vManager Verification Management
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          • System VIP
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      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
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Celsius Thermal Solver

Electrical-thermal co-simulation for system analysis

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Key Benefits

  • Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy
  • Integration with Cadence IC, package, and PCB implementation platforms accelerates and simplifies design iterations
  • Transient as well as steady-state analysis enable accurate electrical-thermal co-simulation
  • Combination of FEA and CFD provides total system analysis
  • Provides RF engineers with ready access to operating temperature data for reliability and performance studies

The Cadence® Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture that delivers up to 10X faster performance than legacy solutions without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and PCB implementation platforms. This enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.

ASK US A QUESTION
Temperature Profile of IC Package Interconnect Structures
Temperature profile of IC package interconnect structures
Multi-Physics Technology

IC and electronic systems companies, particularly those incorporating 3D-IC packaging, face tremendous thermal challenges that can cause late-stage design modifications and iterations and derail project schedules. As the electronics industry moves toward smaller, faster, smarter, and more complex products with greater power density, time-consuming thermal transient analysis techniques must be deployed together with traditional steady-state analysis to address multiple power profiles and increased heat dissipation. Further complicating the process, traditional thermal simulators require simplified models of the electronics and enclosures, resulting in reduced accuracy.

The Celsius Thermal Solver utilizes innovative multi-physics technology to address these challenges. By combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids, the Celsius Thermal Solver enables complete system analysis in a single tool.

 

 Combination of FEA for Solid Structures with CFD for Airflow
Combination of FEA for solid structures with CFD for airflow
Integrated Solution and Transient Capability

When using the Celsius Thermal Solver in conjunction with the Clarity™ 3D Solver, Voltus™ IC Power Integrity, and Sigrity™ technology for PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both electricity and heat for a more accurate system-level thermal simulation than legacy tools. In addition, the Celsius Thermal Solver performs both static (steady-state) and dynamic (transient) electrical-thermal co-simulations based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behavior.

 

Celsius  Transient Electrical-Thermal Co-Simulation Example
Transient electrical-thermal co-simulation example

 

By empowering electronics design teams to analyze thermal issues early and share ownership of thermal analysis, the Celsius Thermal Solver reduces design re-spins and enables new analysis and design insights not possible with legacy solutions. In addition, the Celsius Thermal Solver accurately simulates large systems with detailed granularity for any object of interest and is the first solution capable of modeling structures as small as the IC and its power distribution together with structures as large as the chassis.

Contact Us

Thermal and Stress Analysis of 3D-ICs
READ WHITEPAPER
Celsius Thermal Solver for
Electrothermal Analysis of RF/Microwave Applications
READ DATASHEET
Rising to Meet the Thermal Challenge
Read technical Brief
Customer Paper from
InterPACK
DOWNLOAD PAPER

Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver

  • Related Products

    • Clarity 3D Transient Solver
    • Clarity 3D Solver
    • Allegro PCB Designer
    • AWR Design Environment Platform
    • Voltus IC Power Integrity Solution
    • Allegro Package Designer Plus SiP Layout Option
    • Allegro Package Designer Plus
    • Celsius Advanced PTI
    • Celsius PowerDC
Videos

Announcing Celsius Thermal Solver, a New Approach to System-Level Thermal Analysis

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 1

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 2

The Need for Electro-Thermal Co-simulation

Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver

Thermal Analysis Addresses Reliability and Performance for RF Power Applications

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  • Cadence Shifts into High Gear with McLaren Racing 05/25/2022

  • Cadence Ushers in New Era of Performance and Accuracy for Multiphysics System Simulation with Fidelity CFD 04/19/2022

  • Butterfly Network Leverages Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design 12/14/2021

Blogs VIEW ALL
Customers

The Cadence Celsius Thermal Solver is tightly integrated with the Virtuoso platform, which makes electro-thermal simulations easily and directly accessible to advanced circuit, layout and package designers. The Celsius Thermal Solver offers fast turnaround times and accurate results.

Goeran Jerke, senior project manager EDA Research and Advance Development, Automotive Electronics Division, Robert Bosch GmbH

The addition of the Celsius Thermal Solver to Cadence’s system analysis portfolio allows our mutual customers to deliver next-generation electronic systems because we are now able to support thermal and electrical co-simulation in our design flows.

Vicki Mitchell, vice president of systems engineering, Central Engineering Group, Arm

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