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Digital Design and Signoff
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Custom IC / Analog / RF Design
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
An open IP platform for you to customize your app-driven SoC design.
IC Package Design and Analysis
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
PCB Design and Analysis
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
AI / Machine Learning
AI IP Portfolio
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Perform all phases of RF and microwave component development, from design capture (schematic and layout) to circuit analysis and optimization to electromagnetic (EM) extraction and verification.
Develop system architectures and radio component specifications with behavioral models and communications standard blocks, perform system analysis, budgeting, and circuit co-simulation.
Design, analyze and optimize antennas using planar and arbitrary 3D electromagnetic (EM) solvers to simulate S-parameters, as well as view currents and antenna patterns.
As an electrical engineering student at either the graduate and undergraduate level, learn more about fundamental RF and microwave principles by leveraging circuit examples.