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CADENCE CLOUD

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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AI / Machine Learning

AI IP Portfolio

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View all Products
  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
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        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
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        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
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        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
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        • IC Package
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        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
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Clarity 3D Transient Solver

System-level EM Solver with speed, capacity, and
test-measurement accuracy.

  • Overview
  • Support and Training

Key Benefits

  • Up to 10X faster than legacy 3D FDTD field solvers while maintaining test -measurement accuracy
  • Up to 10X capacity enables true system-level analysis
  • Architecture runs on hundreds of CPUs or multiple GPUs optimized for both cloud and on-premises distributed computing
  • Easily reads design data from all standard chip, PCB, and IC package platforms and offers unique integration with Cadence implementation platforms
  • Imports mechanical structures from all major MCAD tools

The Cadence® Clarity™ 3D Transient Solver is a 3D finite difference time domain (FDTD) electromagnetic (EM) simulation software tool for simulating complex systems and sub-systems. The Clarity Transient 3D Solver lets you tackle the most complex electromagnetic (EM) challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning (ML) applications with test -measurement accuracy.

Clarity 3D Transient Solver simulating an antenna

Industry-leading Cadence distributed multiprocessing technology enables the Clarity 3D Transient Solver to deliver virtually unlimited capacity and 10X speed required to efficiently and effectively address these larger and more complex systems. Reporting is used for electromagnetic compliance (EMC) analysis, susceptibility analysis, antenna placement, biomedical analysis, and other applications.

The Clarity 3D Transient Solver produces results for voltage, current, field distribution, and field animation in the time domain. For frequency domain output, results include specific absorption rate (SAR), near/far field distribution, current distribution, and more.

Save Design Time with Parallelization

Historically, large systems have been analyzed at the sub-system level and results from full-system analysis come from the measurement of prototypes in the lab. No more. We designed the Clarity 3D Transient Solver from the ground up to take advantage of your multi-core compute resources by parallelizing the mathematical tasks required to solve for 3D structures. The tasks can be parallelized within one computer’s cores or across multiple computers, cutting the time to solve for complex structures by 10X and even more.

Industry-leading parallelization technology ensures that simulation tasks can be partitioned and parallelized across as many computers, computer configurations, and cores as are available. The amount of time required to solve is scalable based on the number of computer cores. If a user can double the number of computer cores, performance will be nearly doubled as well.

Cost Savings Solving for 3D Structures with Cloud Infrastructure

Using web-based cloud servers to solve 3D structures can be an alternative to purchasing computing hardware. Instead of choosing large and costly servers, designers using the Clarity 3D Transient Solver can select lower cost cloud-computing resources and still maintain the highest performance. This flexibility can produce considerable savings on the cost of cloud computing expenses when solving for 3D structures.

Complete Design and Analysis Flow

The Clarity 3D Transient Solver is a key component in the Intelligent System Design™ methodology required by advanced electronic product design teams. With a complete design and analysis flow from Cadence, you will be empowered to create reliable and competitive products, deliver on-time and on-budget, and increase your market share.

Features
  • Breakthrough parallelization: Allows engineering managers more flexibility when budgeting for computer configurations required for 3D simulation
  • Flexibility: Brings test-measurement 3D accuracy analysis to engineers responsible for system-level compliance
  • Maximizing resources: No fear of early termination due to computer resources being fully consumed if only a small number of cores is available
  • Available to users of all design platforms: Easily reads design data from all standard chip, IC package, and PCB platforms
  • Integrated 3D solutions: Easily integrate with Cadence Allegro® Package Designer Plus SiP Layout Option, Virtuoso® environment, and Allegro platforms to optimize in the analysis tool and implement in the design tool without being redrawn
  • Model EM interface: Merge mechanical structures such as cables and connectors with their system design and model an EM interface as a single model

Contact Us

  • Related Products

    • Clarity 3D Solver
    • Sigrity SystemSI
    • Cadence PCB: Back-End Board Layout and Routing
    • Allegro Package Designer Plus
    • Allegro Package Designer Plus SiP Layout Option
    • Virtuoso RF Solution
    • Virtuoso System Design Platform
    • Celsius Thermal Solver
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Cadence is committed to keeping design teams highly productive. A range of support offerings and processes helps Cadence users focus on reducing time-to-market and achieving silicon success. Overview

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