Home
  • Products
  • Solutions
  • Support
  • Company
  • EN US
    • SELECT YOUR COUNTRY OR REGION

    • China - 简体中文
    • Japan - 日本語
    • Korea - 한국어
    • Taiwan - 繁體中文

DESIGN EXCELLENCE

  • Digital Design and Signoff
  • Custom IC
  • Verification
  • IP
  • IC Package

SYSTEM INNOVATION

  • System Analysis
  • Embedded Software
  • PCB Design

PERVASIVE INTELLIGENCE

  • AI / Machine Learning
  • AI IP Portfolio

CADENCE CLOUD

VIEW ALL PRODUCTS

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Genus Synthesis Solution
  • Conformal Smart LEC
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Virtuoso RF Solution
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus IC Power Integrity Solution
  • RESOURCES
  • Flows

System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

PRODUCT CATEGORIES

  • Debug Analysis
  • Emulation
  • Formal and Static Verification
  • FPGA-Based Prototyping
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • JasperGold Formal Verification Platform
  • Xcelium Logic Simulation
  • Palladium Z1 Enterprise Emulation Platform
  • Protium X1 Enterprise Prototyping Platform
  • System VIP
  • RESOURCES
  • Flows

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Interface IP
  • Denali Memory IP
  • Tensilica Processor IP
  • Analog IP
  • System / Peripherals IP
  • Verification IP

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Sigrity Advanced SI
  • Sigrity Advanced PI
  • RESOURCES
  • System Analysis Resources Hub

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • What's New in Sigrity
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

AI / Machine Learning

AI IP Portfolio

Industries

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • AI / Machine Learning

Technologies

  • 3D-IC Design
  • Advanced Node
  • Arm-Based Solutions
  • Cloud Solutions
  • Low Power
  • Mixed Signal
  • Photonics
  • RF / Microwave
See how our customers create innovative products with Cadence

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Stay up to date with the latest software 24/7 - Cadence Online Support Visit Now

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

Media Center

  • Events
  • Newsroom
  • Blogs

Culture and Careers

  • Culture and Diversity
  • Careers
Learn how Intelligent System Design™ powers future technologies Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • System Design and Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation
          • Formal and Static Verification
          • FPGA-Based Prototyping
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Z1 Enterprise Emulation Platform
          • Protium X1 Enterprise Prototyping Platform
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • Company
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers

Sigrity Serial Link Analysis

  • Overview
  • Videos
  • News and Blogs
  • Support and Training

Key Benefits

  • Allows compliance checking of multi-gigabit serial link designs such as USB and PCI Express
  • Provides a methodology for creating IBIS-AMI models, leveraging the Cadence IP library of equalization routines
  • Full-wave 3D accurate models created in a fraction of the time of other tools

With the exponential increase in consumer/IoT devices, zettabytes of data are being transferred each year and system designs are typically asked to double transfer speeds every two years. PCI Express® (PCIe®) is expected to move from 8Gbps to 16Gbps with version 4.0. Beyond that, some speculate that 25Gbps and greater signaling will be achieved with multi-level signaling such as PAM-4.

These increasing speeds mean designing a high-speed serial link can no longer be delegated to the expert in the lab running a 3D field solver from 1997. Multi-gigabit serial link design and analysis must find its way to the engineer’s desktop.

At Cadence, we are developing technology that helps you analyze and optimize all sections of the serial link. The transceivers and all the interconnects linking the chips, packages, boards, and connectors can be modeled and simulated to confirm that the serial links in your product will perform to specification.

Convert Transistor-Level Models to Power-Aware IBIS Models

Sigrity™ Transistor-to-Behavioral Model Conversion (T2B™) creates the analog front-end of an IBIS model from transistor-level models.

Sigrity SystemSI™ technology creates the algorithmic portion of the IBIS-AMI model in the form of a dynamic linked library that links to IBIS-compliant channel simulation engines

Accurately Model Signals on the IC Redistribution Layer Coupled to IC Power and Ground

Sigrity XcitePI™ Extraction for chip-level extraction of signal power and ground interconnect from the I/O to the bump with header information enabling push-button connectivity to the extracted package model.

Full Package Modeling Using a Blend of Full-Wave 3D and Hybrid Solver Technology

Sigrity XtractIM™ technology and 3D-EM technology work together to create a complete package model regardless of package type, for coupled signal, power, and ground interconnect models. Also included is package assessment, bridging the gap between the package designer and package characterization engineer.

Get Fast, Accurate Electrical Modeling of PCBs Using a Blend of Full-Wave 3D and Hybrid Solver Technology

Sigrity PowerSI™ technology and 3D-EM technology work together to extract coupled signal, power, and ground from PCBs. Included in the extracted model is header information enabling push-button connectivity to the extracted package model(s) and/or connector model(s).

Explore and Validate Serial Link Interfaces Quickly

Sigrity SystemSI technology provides easy connectivity of power-aware IBIS models with their equalization routines in IBIS-AMI format and power-aware interconnect models. Simulation results exhaustively determine worst-case conditions and compare those results to serial link interface compliance requirements such as USB or PCI Express, allowing you to sign off serial link channel design.

Features

  • Easy-to-use block-level schematic environment
  • Hybrid solver for efficient S-parameter extraction of large interconnect structures
  • 3D full-wave solver for detailed extraction of high-frequency structures
  • Compliance checking for popular serial link interface standards

Contact Us

TRAINING COURSES

Addressing the Challenges of Serial Link Design and Analysis

WEBCAST

Learn how Ericsson more easily verified their design to meet DDR and PCIe specs while avoiding crosstalk by simulating and verifying using Sigrity™ solution with the IBIS/AMI virtual reference design for interface compliance signoff.

  • Related Products

    • Sigrity Transistor-to-Behavioral Model Conversion (T2B)
    • Sigrity SystemSI
    • Sigrity XcitePI Extraction
    • Sigrity XtractIM
    • Sigrity PowerSI
Videos

Sigrity Tech Tip: How to Test Modules for Automotive Ethernet Compliance Before Building a Prototype

Sigrity Tech Tip: How to Accelerate Accurate 3D Full Wave Extraction Time

Sigrity Tech Tip: How to Build an IBIS-AMI Model

Signal Integrity Analysis of Serial Data Channels

Sigrity Tech Tip: How to Accurately Model a Multi-Gigabit Serial Link 10 Times Faster

Sigrity Tech Tip: How to Verify a PAM Encoded Multi-Gigabit Serial Link

News ReleasesVIEW ALL
  • Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers 12/02/2020

  • Cadence DesignTrue DFM Ecosystem Connects Manufacturers with Customers to Ensure PCB Design Manufacturability Early in the Design Process 09/04/2018

  • Cadence Introduces Voltus-XP Technology with Extensive Parallelism, Up to 5X Acceleration, and Increased Capacity for Power Signoff at Advanced Nodes 07/23/2018

  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis 07/19/2018

  • Cadence Sigrity PowerDC Technology Supports Future Facilities' New Open Neutral File Format for Thermal Interoperability 03/19/2018

Blogs VIEW ALL
Support

Cadence is committed to keeping design teams highly productive. A range of support offerings and processes helps Cadence users focus on reducing time-to-market and achieving silicon success. Overview

Cadence Online Support

  • Details about online supportLearn more

  • Have an account already?Log in

  • New to support?Sign up

  • Online support overview Link to video

Customer Support

  • Support Process
  • Software Downloads
  • Computing Platform Support
  • University Software Program
  • Customer Support Contacts
Training

Get the most out of your investment in Cadence technologies through a wide range of training offerings. We offer instructor-led classes at our training centers or at your site. We also offer self-paced online courses. Overview

Course Delivery Methods

  • Instructor-Led Training
  • Online Training
  • Get Cadence Certified

Regional Training Information

  • China
  • Europe, Middle East, and Africa
  • India
  • Japan
  • Korea
  • North America
  • Singapore
  • Taiwan

A Great Place to Do Great Work!

Sixth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • General Inquiry
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2021 Cadence Design Systems, Inc. All Rights Reserved.

Terms of Use Privacy US Trademarks Do Not Sell My Personal Information