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DESIGN EXCELLENCE

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CADENCE CLOUD

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

  • Logic Equivalence Checking
  • Innovus Implementation and Floorplanning
  • Functional ECO
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  • Silicon Signoff and Verification
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  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

  • Circuit Design
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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

  • Debug Analysis
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  • Planning and Management
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  • Verification IP
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  • Flows
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IP

An open IP platform for you to customize your app-driven SoC design.

  • Interface IP
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  • Tensilica Processor IP
  • Analog IP
  • System / Peripherals IP
  • Verification IP
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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
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  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions
  • System Analysis Resources Hub

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • What's New in Allegro
  • What's New in Sigrity
  • RF / Microwave Design
  • Flows
  • Advanced PCB Design & Analysis Blog
  • Watch how to easily tackle complex and cutting edge designs. Learn More
  • Learn why signal integrity analysis needs to be power-aware Watch Now
  • Augmented Reality Lab Tools

AI / Machine Learning

AI IP Portfolio

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SUPPORT

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TRAINING

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View all Products
  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • COMPANY
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      • MEDIA CENTER
        • Events
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      • CULTURE AND CAREERS
        • Culture and Diversity
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      • CORPORATE
        • About Us
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        • Investor Relations
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        • Corporate Social Responsibility
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      • MEDIA CENTER
        • Events
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        • Blogs
      • CULTURE AND CAREERS
        • Culture and Diversity
        • Careers
      • CORPORATE
        • About Us
        • Designed with Cadence
        • Investor Relations
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IPC-2581

IPC-2581 open standard

Product Creation
ECAD MCAD Co-Design
IC/Package/PCB Co-Design
IPC-2581
Constraint-Driven PCB Layout
Allegro TimingVision Environment
Design and Library Data Management
Allegro Sigrity Power Aware Signal Integrity
Allegro PCB Designer Team Design Option
Constraint-Driven PI Signoff

Key Benefits

  • Efficient collaboration between design and manufacturing
  • Open global standard
  • Industry-wide participation

The Cadence® Allegro® PCB Designer enables efficient manufacturing collaboration through IPC-2581, an open, neutral, global standard developed to communicate PCB build intent to manufacturing. Cadence believes it is in the industry’s best interest that an open, public, neutrally maintained standard be adopted by all segments of the PCB design, fabrication, assembly, and test supply chain. Cadence commits to developing and maintaining IPC-2581 import and export from its Allegro and OrCAD® PCB Designer software and to staying current with the latest approved and published IPC-2581 specifications.

Stackup Exchange

With Allegro PCB Designer’s support of the stackup exchange, you are able to build intent collaboration with your fabrication partner. Data now embedded in IPC-2581 file includes layer structure, layer stack sub-groups, materials definition, dielectric materials, conductive materials, coatings, and material characteristics. Stackup defined and analyzed by manufacturing experts can be imported into Allegro PCB Editor, eliminating manual entry.

IPC-2581 Import /Export in Allegro PCB Designer

Allegro PCB Designer supports export and import of IPC-2581 Revision A and Revision B. The IPC-2581 data is passed in a single file that creates accurate and reliable manufacturing data for high-quality manufacturing.

Users have a choice to export a subset of the design data for protecting their IP. Import of IPC-2581 is intended for overlaying artwork data on the design for viewing purposes only.

IPC-2581 Consortium

Cadence is a founding member of the consortium for supply-chain adoption of IPC-2581. IPC-2581 specifies the XML schema that represents the intelligent data file format used to describe PCB and PCB assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a PCB designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines. 

Related Information

  • IPC-2581 Consortium website
  • Download IPC-2581 Rev8 stack-up test case
IPC-2581 import /export in Allegro Designer
Allegro PCB Designer supports export and import of IPC-2581 Revision A and Revision B. The IPC-2581 data is passed in a single file that creates accurate and reliable manufacturing data for high-quality manufacturing. 

Users have a choice to export a subset of the design data for protecting their IP. Import of IPC-2581 is intended for overlaying artwork data on the design for viewing purposes only.
IPC-2581 import /export in Allegro Designer
Allegro PCB Designer supports export and import of IPC-2581 Revision A and Revision B. The IPC-2581 data is passed in a single file that creates accurate and reliable manufacturing data for high-quality manufacturing. 

Users have a choice to export a subset of the design data for protecting their IP. Import of IPC-2581 is intended for overlaying artwork data on the design for viewing purposes only.
IPC-2581 import /export in Allegro Designer
Allegro PCB Designer supports export and import of IPC-2581 Revision A and Revision B. The IPC-2581 data is passed in a single file that creates accurate and reliable manufacturing data for high-quality manufacturing. 

Users have a choice to export a subset of the design data for protecting their IP. Import of IPC-2581 is intended for overlaying artwork data on the design for viewing purposes only.
IPC-2581 import /export in Allegro Designer
Allegro PCB Designer supports export and import of IPC-2581 Revision A and Revision B. The IPC-2581 data is passed in a single file that creates accurate and reliable manufacturing data for high-quality manufacturing. 

Users have a choice to export a subset of the design data for protecting their IP. Import of IPC-2581 is intended for overlaying artwork data on the design for viewing purposes only.
Improve collaboration with supply chain companies through IPC-2581

TRAINING COURSES

Tejas Networks explains how the IPC-2581 design data format and Allegro tools eliminate surprises at the final stages of PCB design

  • Related Products

    • Allegro PCB Designer
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