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Digital Design and Signoff

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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View all Products
  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
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Allegro TimingVision Environment

See real-time delay and phase information right on your routing canvas

Product Creation
ECAD MCAD Co-Design
IC/Package/PCB Co-Design
IPC-2581
Constraint-Driven PCB Layout
Allegro TimingVision Environment
Design and Library Data Management
Allegro Sigrity Power Aware Signal Integrity
Allegro PCB Designer Team Design Option
Constraint-Driven PI Signoff

Key Benefits

  • Innovative environment with smart target technology
  • Accelerates timing closure by 4X
  • Solves timing closure challenge

Cadence® Allegro® TimingVision™ technology provides an innovative and unique environment that allows you to see real-time delay and phase information right on the routing canvas. 

As data rates increase and supply voltages decrease in today’s high-performance interfaces (i.e. DDR3/DDR4, PCle® Gen3 and SATA), PCB and IC package designers have to spend more time to ensure that signals in an interface meet timing requirements. With increasing density, the effort to get to timing closure—ensuring all signals meet timing requirements—can increase significantly. Layout designers need new tools to meet this increasingly complex challenge.

With the embedded route engine, the Allegro TimingVision environment provides real-time feedback during interactive editing and enhances your ability to develop a strategy for resolving timing on large buses or interfaces such as DDRx and PCIe. Coupled with Auto-interactive Phase Tuning (AiPT) and Auto-interactive Delay Tuning (AiDT) capabilities, this environment lets you speed timing closure of high-speed PCB interfaces by up to 75%.

AiDT

Auto-interactive Delay Tuning (AiDT) automatically generates tuning patterns on a user-selected routed byte lane or interface based on user-defined timing constraints and tuning parameters. AiDT computes the required length for the connections to meet timing constraints, and utilizes controlled push/shove techniques when adding tuning patterns.

AiPT

Auto-interactive Phase Tuning (AiPT) automatically matches dynamic and static phases for the selected differential pairs. It works with a set of parameters that provides you with several options for trace lengthening or shortening as well as pad entry/exit options. With AiPT, you can significantly shorten the time to match static and dynamic phases for differential pairs

TRAINING COURSES

Bill Munroe of Cavium talks about how TimingVision technology helped his team achieve 4X faster timing closure on DDR3 and DDR4 memory subsystems.

  • Related Products

    • Allegro PCB Designer
  • Related Links

    • 4X Faster Timing Closure on High-Speed Interfaces with Allegro TimingVision Environment Case Study
    • Three Ways that Allegro TimingVision Environment Speeds Up Timing Closure of High-Speed PCB Interfaces Article
    • Cadence and Pegatron Success Story
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