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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
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System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
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  • What's New in Allegro
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  • Watch how to easily tackle complex and cutting edge designs. Learn More
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  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
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        • System Design and Verification
        • Tensilica Processor IP
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16.6 QIR 5

Learn more about new features

  • Previous Releases
  • 16.6 2015 Release
  • 16.6 QIR 7
  • 16.6 QIR 5
  • 16.6 Release
Hierarchical Interface-Level Design Across Design Authoring, Constraints, and Layout
  • Defines and constrains interfaces
  • Accelerates design intent authoring with interfaces
  • Guides and plans placement using interfaces
  • Accelerates routing and timing closure using interfaces with innovative auto-interactive technologies
Auto-Interactive Interface Trunk Routing, Scribble Routing
  • Route to trunk for interfaces: Used in conjunction with breakout planning to route main body (trunk) of an interface.
  • Split view: Initially introduced with Auto-interactive Breakout tuning, users can use split views to see one end of an interface bundle in one view and the other end of the interface in another allowing users to zoom into the two ends
  • Scribble routing: Scribble is a simple routing mode that allows you to ‘scribble’ a route path onto the canvas. Once a click is made, the etch solution for the scribble path will be generated. Scribble provides a quick two-pick methodology to generate complex route paths, along with very controlled usage of push/shove based on the scribble path
Slide Etch During Component Move
  • Auto re-routes etch to either 45 or 90 degree angles, eliminating time to clean up etch after moving a component that is already routed
IPC-2581 Manufacturing Output Supports Latest RevB Specification

IPC-2581 provides an intelligent, robust methodology for driving manufacturing. Allegro PCB Editor has supported IPC-2581 since 16.5 release. This QIR allows users to output IPC-2581 in RevB format and supports enhancements for assembly data (Pin1, Polarity markings, pick up point, and other assembly-related data). For more information about IPC-2581 consortium, visit www.ipc2581.com.

PADS PowerPCB Footprint Library Translation
  • Allows users to translate PADS PowerPCB footprint library to Allegro® Footprints
Allegro EDM Integration with PTC Windchill for Component Data and Team Design Data Management
  • Compatible with Windchill 10.2 M010 release in December 2013
  • Provides work-in-progress design data management for PCB designs
Dynamic Rat Suppression
  • All rats expect active net are temporarily suppressed during Add Connect
  • De-clutters canvas during routing improving designer productivity
New Drafting Capabilities
  • Relative move and copy: move and copy elements about a user-specified axis
  • Drafting functions introduced in previous QIRs:
    • Add parallel line
    • Add perpendicular line
    • Delete by line
    • Delete by rectangle
    • Offset copy
    • Offset move
    • Relative copy
    • Relative move
Allegro PCB Analog/RF Option Integrates with AWR’s MWO
  • Support for Microwave Office (MWO) stripline and microstripline library components
  • Import schematics from MWO into Allegro Design Authoring (DE-HDL)
  • Import and export of RF design from MWO to Allegro PCB Analog/RF Option

TRAINING COURSES

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News ReleasesVIEW ALL
  • Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers 12/02/2020

  • Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications 12/02/2019

  • Cadence Presented with Four 2019 TSMC Partner of the Year Awards 10/30/2019

  • Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES 02/14/2019

  • Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers 11/13/2018

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