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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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Multiphysics System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
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US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
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        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
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        • Technical Forums
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        • Custom IC / Analog / RF Design
        • Languages and Methodologies
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        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
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        • Technical Forums
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Allegro Right First-Time Design

Constraint-driven design with an integrated layout and analysis solution

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Late-stage design changes are incredibly costly. The later the change, the more rework is required, and the more expensive the project becomes. So naturally, you want to find those errors as soon as possible. But here’s the thing, no matter how early you find that error, you’ve still made an error.

Finding mistakes, fixing mistakes; you’re missing the point.

Don’t make mistakes.

Make It Work: Allegro Vision and Analysis Technology

It takes creativity to solve the complex design challenges of cramming more components and more traces in a smaller space. Even if everything fits, the biggest question is “will it work?” The unique Cadence® Allegro® vision and analysis technology, driven by our proven constraint-driven design flow, makes it easy for designers of all skill levels and experience to improve design quality in your high-speed, high-density designs.

Visual indicators and automatic channel optimizations help designers place traces and components perfectly for optimal performance, without needing any off-sheet calculations.

Performance insights are more complex than manufacturing constraints. The Allegro vision and analysis technology shows designers how placement impacts propagation, timing, and delay constraints, something a simple distance-based manufacturing check can’t do.

Ultimately, the biggest challenges designers face are signal integrity issues. The integrated analysis technology helps designers avoid return path and impedance issues, coupling and crosstalk issues, and more, visually, by highlighting problematic traces in real time while designing; without sending the board off to an SI expert, and without having to wait for results.

Make It Fit: Interactive 3D

The thing you’re designing is not 2D. A final PCB exists in the real world in all three dimensions, and you need to think three-dimensionally when you’re designing.

View the enclosure and other mechanical elements of the final product in your PCB design environment and verify fit in the interactive 3D canvas, without going back and forth with the mechanical designer. Mechanical engineers and PCB designers can push and pull changes between Allegro PCB Editor and the mechanical design environment.

Get placement of all your components just right by moving things around in the interactive 3D canvas or move them in 2D and see the update in 3D, side by side in real time. Automated collision checks can even show issues that you can’t see from any angle.

Make It: Allegro PCB DesignTrue DFM Technology

Manufacturing is the last step of the design process. But manufacturability problems in the design can only be fixed by going back and re-designing. Leave manufacturability checks to the end, and you’ll have to start your design all over when you find a problem.

Allegro PCB DesignTrue DFM Technology applies your manufacturing, fabrication, test, and assembly rules before you start designing so that every route and every component placement is verified against your unique rules.

Visual error markers flag copper and non-copper feature-related fabrication, assembly, and test issues so designers can correct them in real time without cascading consequences to the design later.

  • Related Products

    • Allegro PCB DesignTrue DFM Technology
    • Allegro PCB Designer

TRAINING COURSES

Videos

3D Spacing Measurements

Signoff with Confidence

Improve Design Impedance from PCB Canvas

Improve Route Quality

Real-Time DFM Verification

Optimize Component Placement

Integrated Design for Test (DFT) Checks

3D Component Placement and Movement

Manage Signal Return Path

News ReleasesVIEW ALL
  • Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers 11/13/2018

  • Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies 10/02/2018

  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis 07/19/2018

  • New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board 05/30/2017

  • Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff 01/25/2017

Blogs VIEW ALL
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