Key Benefits
- Helps build accurate RLC IBIS or SPICE models more than 10X faster than alternate approaches
- Unique assessment capabilities quickly identify potential package performance issues
- Supports broadband multi-stage optimized models and multiple package types
- Thermal model extraction of IC packages
- Time-domain simulation environment for easy quality assessment of created interconnect models
To help you create accurate models for IC package structures, the interconnect model extraction technology is available through both hybrid solver and full-wave 3D solver extraction technology. In addition to model extraction, several performance assessment workflows are available to help quickly highlight the deployment of less-than-optimal package design techniques. When utilizing the hybrid solver technology, RLC, IBIS, or SPICE IC, package electrical models can be created up to 10X faster than alternative approaches.
The tool suite also includes thermal model extraction to enable sharing the package model with PCB design teams required to run a cross-fabric electrothermal analysis.
The Clarity IC Package Extraction tool suite also includes all technology in the Clarity PCB Extraction Suite. This complete extraction solution complements both the Sigrity Advanced SI and Sigrity SystemPI solutions.
Features
- Extracts models of entire packages or selected nets
- Visualizes potential package performance issues
- Flexible 2D/3D visualization, plotting, and spreadsheet data management
- Optimized for flows with Allegro Package Designer SiP Layout Option, Allegro Package Designer Plus, and Allegro PCB Designer
- Readily used in Mentor, Zuken, and Altium flows, accepting a mix of CAD databases, where needed, for multi-structure design