To help you tackle increasingly challenging issues related to simultaneous switching noise, signal coupling, and target voltage levels, Cadence® Sigrity™ PowerSI® technology provides fast, accurate, and detailed electrical analysis of full IC packages or PCBs. It is cloud ready and can be used pre-layout to develop power- and signal-integrity guidelines, as well as post-layout to verify performance and improve a design without needing a prototype.
Using Sigrity PowerSI electromagnetic (EM) field solver technology, you can readily perform a broad range of studies to identify trace and via coupling issues, power/ground fluctuations caused by simultaneously switching outputs, and design regions that are under or over voltage targets. PowerSI technology also lets you perform extraction of frequency-dependent network parameter models and lets you visualize complex spatial relationships.
Features
- Facilitates AC analysis to assess voltage distribution across ground planes
- Establishes power delivery network (PDN) guidelines for IC packages and boards
- Evaluates electromagnetic coupling between geometries to enable better component, via, and decap placement
- Extracts frequency-dependent S, Z, and Y parameters for package and board modeling for subsequent time domain SSN simulation
- Anticipates energy leaks with near-field ration display
- Assesses decoupling capacitor strategies and verifies placement effects Enables broadband modeling including accurate DC performance characterization (patent pending)
- Integrates seamlessly with 3D solutions for IC packages and boards
- Distributed computing option accelerates analysis time (additional license required)
- Strong HSPICE flow support
- Optimized for flows with Cadence SiP Layout, Allegro® Package Designer, and Allegro PCB Designer
- Readily used in Mentor, Zuken, and Altium flows, accepting a mix of CAD databases where needed for multi-structure design support
