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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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System Analysis

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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • System Design and Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation
          • Formal and Static Verification
          • FPGA-Based Prototyping
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Z1 Enterprise Emulation Platform
          • Protium X1 Enterprise Prototyping Platform
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
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        • RF / Microwave
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Allegro PCB Symphony Team Design Option for IC Packaging

Concurrent engineering and distributed design

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Key Benefits

  • Concurrent engineering and distributed design let multiple designers work on the same design in real time
  • Shortens the largest portion of your layout design cycle
  • Reduces time to route advanced high-speed interfaces by 80%

With a worldwide design team, it can be difficult to shorten design cycle times. Manual workarounds that address multi-user issues are time consuming, slow, and prone to error. Cadence® SiP Layout XL provides two ways for IC package design teams to collaborate—concurrent engineering using a shared canvas and distributed team design with a partitioned canvas. Either way, multiple designers can work on the same design to reduce layout time.

Concurrent Engineering Using a Shared Canvas

The concurrent engineering option using Cadence SiP Layout XL with Allegro® PCB Symphony Team Design Option shortens the largest portion of the layout design cycle. Its shared canvas provides a low-overhead environment that enables multiple designers to work on the same design, on the same canvas, and at the same time without the set-up requirements of a partitioned project. The more routing engineers you add, the faster your team can finish routing.

By connecting multiple designers to a common SiP Layout database, any changes made on their canvases are reflected on the server and seen by other designers, eliminating copy/paste “chaos.”

Easy to Set Up and Easy to Use
  • Ad-hoc mode eliminates set-up—Bring other team members into a design on a moment’s notice. Join or leave the session at any time, knowing that all design updates have been updated to the master database
  • More structured approach—Host the design on a network server where multiple designers can access the server and start the concurrent design process. Design can be managed centrally without requiring user intervention
Collaboration with Extended Team

Many tasks frequently interrupt the implementation process early in the design cycle—die ECOs, netlist updates, MCAD updates, constraint updates, etc.

  • Constraint editing with Allegro PCB Symphony Team Design Option allows a client exclusive access to Constraint Manager while everyone continues their design work concurrently.
  • You can leverage netlist import and MCAD import within the Allegro PCB Symphony Team Design Option session without disconnecting team members from the session.

Powerful Features

While in the concurrent team design environment, designers can use these features to accelerate new product introduction, including:

  • 3D visualization while connected to a session
  • Shape editing and shape design for power delivery
  • Placement Edit Application mode
  • Interactive etch-editing commands and Allegro auto-interactive phase tune (AiPT) and auto-interactive delay tune (AiDT) capabilities, as well as dynamic shape voiding during routing
  • Impedance analysis and vision
  • Report generation and full/window DRC update

Distributed Team Design on Partitioned Canvas

The distributed partitioning option, Allegro Design Partitioning Option (included with SiP Layout XL), lets designers work on individual design sections exported from a master design. Partitioning a design for layout and editing by several design team members accelerates the time to complete the layout process. Each designer can see all partitioned sections and update the design view for monitoring the status and progress of other users’ sections.

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  • Related Products

    • Allegro Package Designer Plus
    • Allegro Package Designer Plus SiP Layout Option
    • SIP Layout Wlcsp Option
News ReleasesVIEW ALL
  • Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology 10/17/2019

  • Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology 04/23/2019

  • Cadence Supports New TSMC WoW Advanced Packaging Technology 05/01/2018

  • ASE and Cadence Deliver First System-in-Package EDA Solution Tailored for ASE’s High-Performance, Advanced IC Package Technologies 01/31/2018

  • Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology 09/21/2016

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