• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • Products
  • Solutions
  • Support
  • Company

Free Trials

Cadence.AI

  • Millennium Platform

    AI-driven digital twin supercomputer

  • Cadence Cerebrus AI Studio

    Multi-block, multi-user SoC design platform

  • Optimality Intelligent System Explorer

    AI-driven Multiphysics analysis

  • Verisium Verification Platform

    AI-driven verification platform

  • Allegro X AI

    AI-driven PCB Design

  • Tensilica AI Platform

    On-device AI IP

IC Design & Verification

  • Virtuoso Studio

    Analog and custom IC design

  • Spectre Simulation

    Analog and mixed-signal SoC verification

  • Innovus+ Platform

    Synthesis and implementation for advanced nodes

  • Xcelium Logic Simulation

    IP and SoC design verification

  • Silicon Solutions

    Protocol IP and Compute IP, including Tensilica IP

  • Palladium and Protium

    Emulation and prototyping platforms

System Design & Analysis

  • Allegro X Design Platform

    System and PCB design platform

  • Allegro X Adv Package Designer Platform

    IC packaging design and analysis platform

  • Sigrity X Platform

    Signal and power integrity analysis platform

  • AWR Design Environment Platform

    RF and microwave development platform

  • Cadence Reality Digital Twin Platform

    Data center design and management platform

  • Fidelity CFD Platform

    Computational fluid dynamics platform

  • All Analog IC Design Products

  • All Verification Products

  • All Digital Design and Signoff Products

  • All 3D-IC Design Products

  • All PCB Design Products

  • All 3D Electromagnetic Analysis Products

  • All Thermal Analysis Products

  • All Molecular Simulation Products

  • All Cadence Cloud Services and Solutions

  • All Products (A-Z)

Industries

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • Data Center Solutions
  • Hyperscale Computing
  • Life Sciences

Services

  • Services Overview
  • Chiplet Design Services
  • Custom Silicon Services

Technologies

  • Artificial Intelligence
  • 3D-IC Design
  • Advanced Node
  • Arm-Based Solutions
  • Chiplets
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • Low Power
  • Mixed-signal
  • Molecular Simulation
  • Multiphysics System Analysis
  • Photonics
  • RF / Microwave
Designed with Cadence See how our customers create innovative products with Cadence
Explore Cadence Cloud Now Explore Cadence Cloud Now

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Community Forums
  • OnCloud Help Center
  • Doc Assistant

Training

  • Computational Fluid Dynamics Courses
  • Custom IC / Analog / Microwave & RF Design Courses
  • Digital Design and Signoff Courses
  • IC Package Courses
  • Languages and Methodologies Courses
  • Mixed-Signal Design Modeling, Simulation, and Verification
  • Onboarding Curricula
  • PCB Design Courses
  • Reality DC
  • System Design and Verification Courses
  • Tech Domain Certification Programs
  • Tensilica Processor IP Courses
Stay up to date with the latest software
Cadence award-winning online support available 24/7
Connect with expert users in our Community Forums

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Channel Partners
  • Technology Partners
  • Corporate Social Responsibility
  • Cadence Academic Network
  • Intelligent System Design

Culture and Careers

  • Careers
  • Culture
  • One Team
  • Intern and Grads

Media Center

  • Cadence Events
  • Events
  • Newsroom
  • Blogs
Cadence Giving Foundation
Premier Cadence Events

This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  • Products

    • Products

      Cadence.AI

      • Millennium Platform

        AI-driven digital twin supercomputer

      • Cadence Cerebrus AI Studio

        Multi-block, multi-user SoC design platform

      • Optimality Intelligent System Explorer

        AI-driven Multiphysics analysis

      • Verisium Verification Platform

        AI-driven verification platform

      • Allegro X AI

        AI-driven PCB Design

      • Tensilica AI Platform

        On-device AI IP

    • Products

      IC Design & Verification

      • Virtuoso Studio

        Analog and custom IC design

      • Spectre Simulation

        Analog and mixed-signal SoC verification

      • Innovus+ Platform

        Synthesis and implementation for advanced nodes

      • Xcelium Logic Simulation

        IP and SoC design verification

      • Silicon Solutions

        Protocol IP and Compute IP, including Tensilica IP

      • Palladium and Protium

        Emulation and prototyping platforms

    • Products

      System Design & Analysis

      • Allegro X Design Platform

        System and PCB design platform

      • Allegro X Adv Package Designer Platform

        IC packaging design and analysis platform

      • Sigrity X Platform

        Signal and power integrity analysis platform

      • AWR Design Environment Platform

        RF and microwave development platform

      • Cadence Reality Digital Twin Platform

        Data center design and management platform

      • Fidelity CFD Platform

        Computational fluid dynamics platform

    • All Analog IC Design Products
    • All Verification Products
    • All Digital Design and Signoff Products
    • All 3D-IC Design Products
    • All PCB Design Products
    • All 3D Electromagnetic Analysis Products
    • All Thermal Analysis Products
    • All Molecular Simulation Products
    • All Cadence Cloud Services and Solutions
    • All Products (A-Z)
  • Solutions

    Industries

    • 5G Systems and Subsystems

    • Aerospace and Defense

    • Automotive

    • Data Center Solutions

    • Hyperscale Computing

    • Life Sciences

    Services

    • Services Overview

    • Chiplet Design Services

    • Custom Silicon Services

    Technologies

    • Artificial Intelligence

    • 3D-IC Design

    • Advanced Node

    • Arm-Based Solutions

    • Chiplets

    • Cloud Solutions

    • Computational Fluid Dynamics

    • Functional Safety

    • Low Power

    • Mixed-signal

    • Molecular Simulation

    • Multiphysics System Analysis

    • Photonics

    • RF / Microwave

    Designed with Cadence See how our customers create innovative products with Cadence
    Explore Cadence Cloud Now Explore Cadence Cloud Now
  • Support

    Support

    • Support Process

    • Online Support

    • Software Downloads

    • Computing Platform Support

    • Customer Support Contacts

    • Community Forums

    • OnCloud Help Center

    • Doc Assistant

    Training

    • Computational Fluid Dynamics

    • Custom IC / Analog / RF Design

    • Digital Design and Signoff

    • IC Package

    • Languages and Methodologies

    • Mixed-Signal Design Modeling, Simulation, and Verification

    • Onboarding Curricula

    • PCB Design

    • Reality DC

    • System Design and Verification

    • Tech Domain Certification Programs

    • Tensilica Processor IP

    Stay up to date with the latest software
    Cadence award-winning online support available 24/7
    Connect with expert users in our Community Forums
  • Company

    Corporate

    • About Us

    • Designed with Cadence

    • Investor Relations

    • Leadership Team

    • Computational Software

    • Alliances

    • Channel Partners

    • Technology Partners

    • Corporate Social Responsibility

    • Cadence Academic Network

    • Intelligent System Design

    Culture and Careers

    • Careers

    • Culture

    • One Team

    • Intern and Grads

    Media Center

    • Cadence Events

    • Events

    • Newsroom

    • Blogs

    Cadence Giving Foundation
    Premier Cadence Events

Free Trials

Conformal Equivalence
Checker

Providing formal verification technology for fast, accurate bug
detection and correction

Read Datasheet
  • Overview
  • News and Blogs
  • Support and Training

Key Benefits

  • Exhaustively verifies multi-million–gate ASICs several times faster than traditional gate-level simulation 
  • Decreases the risk of missing critical bugs with independent verification technology 
  • Enables faster, more accurate bug detection and correction throughout the entire design flow 
  • Extends equivalence checking capability to complex datapaths and closes the RTL-to-layout verification gap (XL configuration) 
  • Ensures RTL models perform the same functions as the corresponding transistor circuits implemented on silicon (GXL configuration) 

Cadence® Conformal® Equivalence Checker (EC) makes it possible to verify and debug multi-million–gate designs without using test vectors. It offers the industry’s only complete equivalence checking solution for verifying SoC designs—from RTL to final LVS netlist (SPICE). Cadence Conformal EC enables designers to verify the widest variety of circuits, including complex arithmetic logic, datapaths, memories, and custom logic.

 

Already proven in thousands of tapeouts, Conformal EC is the industry’s most widely supported independent equivalence checking product. It is production-proven on more physical design closure products, advanced synthesis software, ASIC libraries, and IP cores than any other formal verification technology.

Contact Us

TRAINING COURSES

  • Related Products
    • Conformal Smart LEC
    • Genus Synthesis Solution
    • Innovus Implementation System
News ReleasesVIEW ALL
  • Cadence Introduces Industry-First LPDDR6/5X 14.4Gbps Memory IP to Power Next-Generation AI Infrastructure 07/09/2025

  • Cadence Announces Second Quarter 2025 Financial Results Webcast 07/03/2025

  • Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry 06/16/2025

  • Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud 06/11/2025

  • Cadence’s John Wall to Present at BofA Conference 05/27/2025

Blogs VIEW ALL

Training and Support

Need Help?

Training

The Training Learning Maps help you get a comprehensive visual overview of learning opportunities.
Training News - Subscribe

Browse training

Online Support

The Cadence Online Support (COS) system fields our entire library of accessible materials for self-study and step-by-step instruction.

Request Support

Technical Forums

Find community on the technical forums to discuss and elaborate on your design ideas.


Find Answers in cadence technical forums
Fortune: 100 Best Companies to Work for 2025

A Great Place to Do Great Work!

Tenth year on the FORTUNE 100 list

Wall Street Journal Best Managed Companies

The Wall Street Journal

Best Managed Companies

Our Culture Join The Team

Products Products

  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • Silicon Solutions
  • PCB Design
  • System Analysis
  • Verification
  • All Products

Company Company

  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Channel Partners
  • Technology Partners
  • Careers
  • Cadence Academic Network
  • Supplier

Media Center Media Center

  • Events
  • Newsroom
  • Designed with Cadence
  • Blogs
  • Forums
  • Glossary
  • Resources

Contact Us Contact Us

  • Customer Support
  • Media Relations
  • Global Office Locator
  • Information Security

Sign up to receive the latest Cadence news

Thank you for subscribing. You will get an email to confirm your subscription.

English (US)
  • English
    United States
  • 简体中文
    China
  • 日本語
    Japan
  • 한국어
    Korea
  • 繁體中文
    Taiwan

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • US Trademarks
  • Terms of Use
  • Privacy
  • Cookie Policy
  • Accessibility
  • Do Not Sell or Share My Personal Information

© 2025 Cadence Design Systems, Inc. All Rights Reserved.